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SN74ALS240ANSR

Texas Instruments

SN74ALS240ANSR by Texas Instruments

SN74ALS240ANSR by Texas Instruments is a TTL technology bus driver with 4 bits, 9ns propagation delay, and 3-STATE output. It operates at a supply voltage of 5V and has a load capacitance of 50pF. Ideal for unidirectional count applications in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 4,947 parts In-Stock

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Digiode

USA . 3,147 parts In-Stock

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Vyrian

USA . 2,648 parts In-Stock

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2,648

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Zilex Electronics Inc.

Canada . 1,148 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 5,818 parts In-Stock

1+ parts

$4.346

100+ parts

-

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$4.172

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$4.172

5,818

$4.346

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$4.172

$4.172

Parana Technologies

USA . 1,486 parts In-Stock

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$14.584

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$15.023

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1,486

$14.584

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$15.023

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DigiPath Technology Company

USA . 1,248 parts In-Stock

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$16.059

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$14.775

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$16.059

$14.775

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AZTECH Wire

Italy . 234 parts In-Stock

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$16.230

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234

$16.230

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ChromeModa Solutions

Germany . 5,008 parts In-Stock

1+ parts

$16.387

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$13.437

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5,008

$16.387

$13.437

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IDEA Electronic Components Group

UK . 929 parts In-Stock

1+ parts

$16.387

100+ parts

$15.568

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$14.748

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929

$16.387

$15.568

$14.748

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One Stop Electronics

USA . 373 parts In-Stock

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$31.000

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373

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Microchip USA

USA . 6,846 parts In-Stock

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Kepictronics

USA . 5,688 parts In-Stock

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Corphita

USA . 1,956 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,172 parts In-Stock

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Perfect Parts

USA . 461 parts In-Stock

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Overview

Enhance your electronic projects with the SN74ALS240ANSR by Texas Instruments, a top-of-the-line bus driver & transceiver that guarantees quality and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled performance and durability. Ideal for a wide range of applications, this small outline package device with inverted output polarity and 3-state characteristics will elevate your designs to new heights. Experience the value and benefits that only Texas Instruments can provide, and take your projects to the next level with the SN74ALS240ANSR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it easy to handle and robust for long-term use.

Propagation Delay At Nominal Supply: 9 ns

The low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Nominal Supply Voltage / Vsup (V): 5

The compatibility with a standard nominal supply voltage of 5V makes the product easily integrable with existing systems.

Output Characteristics: 3-STATE

The 3-state output allows for flexibility in controlling the output signal, providing options for enabling, disabling, or tristating the output.

Technical Specifications

Bus Driver & Transceivers SN74ALS240ANSR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ALS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74ALS240ANSR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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