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SN74AHCT374DBRG4

Texas Instruments

SN74AHCT374DBRG4 by Texas Instruments

SN74AHCT374DBRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.5 ns at 5V, suitable for industrial applications. It features a 3-STATE output and operates b/w -40 to 85°C, making it ideal for enabling low control in unidirectional systems. The package style is small outline with shrink pitch, offering surface mount capability and a max frequency of 75 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,682 parts In-Stock

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Vyrian

USA . 4,170 parts In-Stock

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4,170

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Distributors (Availability)

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Andel Nordic

Denmark . 4,341 parts In-Stock

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$4.623

100+ parts

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$4.438

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$4.438

4,341

$4.623

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$4.438

AZTECH Wire

Italy . 466 parts In-Stock

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$7.272

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466

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Parana Technologies

USA . 2,341 parts In-Stock

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$29.073

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$55.101

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$55.101

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DigiPath Technology Company

USA . 1,625 parts In-Stock

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$32.013

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$32.013

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ChromeModa Solutions

Germany . 5,676 parts In-Stock

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$32.666

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$26.786

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$32.666

$26.786

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IDEA Electronic Components Group

UK . 923 parts In-Stock

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$32.666

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$31.033

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$29.399

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923

$32.666

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$29.399

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One Stop Electronics

USA . 1,402 parts In-Stock

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$41.000

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Corphita

USA . 1,779 parts In-Stock

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Microchip USA

USA . 1,264 parts In-Stock

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Overview

Enhance your electronic projects with the SN74AHCT374DBRG4 by Texas Instruments, a high-quality Bus Driver & Transceiver designed to deliver reliable performance. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled value and benefits to customers. Ideal for a wide range of applications, this 8-bit component boasts a fast propagation delay, low power consumption, and versatile features like 3-STATE output characteristics. Upgrade your systems with the SN74AHCT374DBRG4 and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast communication and response times, making this product suitable for real-time applications.

Surface Mount: YES

Surface mount capability makes installation and assembly convenient, saving space and reducing overall product size.

No. of Bits: 8

8-bit capability allows for a wide range of data transmission, suitable for handling various communication protocols and signals.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance and compatibility with standard voltage levels in electronic systems.

Load Capacitance (CL): 50 pF

Having a load capacitance of 50 pF ensures efficient signal transmission and reception, enhancing overall communication reliability.

Power Supplies (V): 5

Compatibility with 5V power supplies makes integration with existing systems easier and more straightforward.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with various components and systems, enhancing versatility.

Maximum I (ol): 8 Amp

High maximum output current capability of 8A allows the product to drive demanding loads with ease, ensuring robust performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85°C enables reliable operation in various environmental conditions, suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers SN74AHCT374DBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74AHCT374DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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