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SN74AHCT244QDWRG4

Texas Instruments

SN74AHCT244QDWRG4 by Texas Instruments

SN74AHCT244QDWRG4 by Texas Instruments is a 20-terminal CMOS bus driver with 9.5 ns propagation delay, suitable for automotive applications. It features a 5V nominal voltage, 50 pF load capacitance, and 8 Amp max I (ol). This small outline package has a surface mount design and operates b/w -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,761 parts In-Stock

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Digiode

USA . 3,512 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 4,312 parts In-Stock

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$6.495

100+ parts

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$6.235

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$6.235

4,312

$6.495

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$6.235

$6.235

AZTECH Wire

Italy . 430 parts In-Stock

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$19.138

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430

$19.138

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Parana Technologies

USA . 920 parts In-Stock

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$23.524

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$24.158

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920

$23.524

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$24.158

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DigiPath Technology Company

USA . 1,299 parts In-Stock

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$25.903

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$23.831

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1,299

$25.903

$23.831

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ChromeModa Solutions

Germany . 3,009 parts In-Stock

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$26.432

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$21.674

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$26.432

$21.674

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IDEA Electronic Components Group

UK . 639 parts In-Stock

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$26.432

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$25.110

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$23.789

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639

$26.432

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$23.789

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One Stop Electronics

USA . 973 parts In-Stock

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$31.000

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Component Stockers USA

USA . 396 parts In-Stock

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$99.990

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Kepictronics

USA . 7,200 parts In-Stock

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Corphita

USA . 4,748 parts In-Stock

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Microchip USA

USA . 2,164 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the SN74AHCT244QDWRG4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures swift and efficient communication across devices. Experience the value of seamless connectivity and optimize your systems with the exceptional benefits and advantages that this innovative solution has to offer. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use, making this product a good choice for robust applications.

Propagation Delay At Nominal Supply: 9.5 ns

With a low propagation delay, this product ensures fast and efficient signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, making this product user-friendly and space-efficient.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this product is compatible with a wide range of existing systems and can be easily integrated into various electronic setups.

Output Polarity: TRUE

Having true output polarity ensures that the signal is accurately represented, reducing the risk of errors in data transmission and making this product reliable for critical applications.

Technical Specifications

Bus Driver & Transceivers SN74AHCT244QDWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74AHCT244QDWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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