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SN74AHC374DGVRE4

Texas Instruments

SN74AHC374DGVRE4 by Texas Instruments

SN74AHC374DGVRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.5 ns at 3.3V, suitable for industrial applications. It features a max frequency of 75MHz, operates b/w -40 to 85°C, and has a terminal pitch of 0.4mm for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,806 parts In-Stock

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Digiode

USA . 3,150 parts In-Stock

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3,150

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Distributors (Availability)

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AZTECH Wire

Italy . 660 parts In-Stock

1+ parts

$16.858

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660

$16.858

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Parana Technologies

USA . 1,782 parts In-Stock

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$19.588

100+ parts

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$19.585

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1,782

$19.588

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$19.585

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DigiPath Technology Company

USA . 324 parts In-Stock

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$21.569

100+ parts

$19.843

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324

$21.569

$19.843

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ChromeModa Solutions

Germany . 4,295 parts In-Stock

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$22.009

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$18.047

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4,295

$22.009

$18.047

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IDEA Electronic Components Group

UK . 756 parts In-Stock

1+ parts

$22.009

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$20.909

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$19.808

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756

$22.009

$20.909

$19.808

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One Stop Electronics

USA . 904 parts In-Stock

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$27.000

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904

$27.000

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Corphita

USA . 4,944 parts In-Stock

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Microchip USA

USA . 146 parts In-Stock

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Overview

Discover the innovative SN74AHC374DGVRE4 by Texas Instruments, a high-quality bus driver & transceiver designed to enhance your electronic projects. With Texas Instruments' reputation for excellence in electronics manufacturing, this product offers unmatched reliability and performance. Ideal for applications requiring fast signal transmission, this 8-bit transceiver operates at a nominal voltage of 3.3V, making it suitable for a wide range of projects. Experience the value and benefits of using the SN74AHC374DGVRE4 in your designs, where quality meets efficiency for outstanding results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast signal transmission, making the product efficient in data communication.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient, saving valuable space on the PCB.

No. of Bits: 8

The 8-bit configuration allows for a wide range of data transmission and processing capabilities, suitable for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a range of devices, making it versatile in different settings.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for compact design and high-density integration on the PCB, maximizing space efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides flexibility in power input options, making the product adaptable to various power sources.

Technical Specifications

Bus Driver & Transceivers SN74AHC374DGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74AHC374DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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