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SN74AHC245MDWREP

Texas Instruments

SN74AHC245MDWREP by Texas Instruments

SN74AHC245MDWREP by Texas Instruments is an 8-bit bus driver with a propagation delay of 13.5 ns at 3.3V, suitable for bidirectional applications. It features a max operating temperature of 125°C, true output polarity, and a small outline package style ideal for military-grade technology.

Median Price

$1.552

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,999 parts In-Stock

1+ parts

$3.920

100+ parts

$2.010

1k+ parts

$1.460

10k+ parts

$1.370

1,999

$3.920

$2.010

$1.460

$1.370

Rochester

USA . 407 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.140

10k+ parts

$1.070

407

-

$1.270

$1.140

$1.070

DigiKey

USA . 407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.680

10k+ parts

-

407

-

-

$1.680

-

Verical

USA . 407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.425

10k+ parts

$1.337

407

-

-

$1.425

$1.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,269 parts In-Stock

1+ parts

$1.168

100+ parts

-

1k+ parts

-

10k+ parts

-

3,269

$1.168

-

-

-

Vyrian

USA . 3,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,403

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 54 parts In-Stock

1+ parts

$0.940

100+ parts

$0.916

1k+ parts

$0.912

10k+ parts

-

54

$0.940

$0.916

$0.912

-

Corphita

USA . 4,197 parts In-Stock

1+ parts

$1.107

100+ parts

-

1k+ parts

-

10k+ parts

-

4,197

$1.107

-

-

-

Microchip USA

USA . 2,164 parts In-Stock

1+ parts

$6.824

100+ parts

-

1k+ parts

-

10k+ parts

-

2,164

$6.824

-

-

-

Parana Technologies

USA . 1,990 parts In-Stock

1+ parts

$8.431

100+ parts

-

1k+ parts

$9.071

10k+ parts

-

1,990

$8.431

-

$9.071

-

Andel Nordic

Denmark . 461 parts In-Stock

1+ parts

$9.032

100+ parts

-

1k+ parts

$8.671

10k+ parts

$8.671

461

$9.032

-

$8.671

$8.671

DigiPath Technology Company

USA . 632 parts In-Stock

1+ parts

$9.284

100+ parts

-

1k+ parts

-

10k+ parts

-

632

$9.284

-

-

-

IDEA Electronic Components Group

UK . 1,476 parts In-Stock

1+ parts

$9.473

100+ parts

$8.999

1k+ parts

$8.526

10k+ parts

-

1,476

$9.473

$8.999

$8.526

-

ChromeModa Solutions

Germany . 454 parts In-Stock

1+ parts

$9.473

100+ parts

$7.768

1k+ parts

-

10k+ parts

-

454

$9.473

$7.768

-

-

Overview

Elevate your electronic designs with the SN74AHC245MDWREP by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance and reliability for a wide range of applications. Benefit from the top-notch quality and cutting-edge technology that Texas Instruments is known for, while experiencing the seamless communication and data transmission provided by this product. Trust in the value and advantages that the SN74AHC245MDWREP brings to your projects, and take your creations to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in buses where the equipment needs to withstand frequent movement and vibrations.

Propagation Delay At Nominal Supply: 13.5 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed bus communication systems.

Surface Mount: YES

Surface mount capability allows for easy and secure installation of the bus driver/transceiver on PCBs, saving space and simplifying assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V, this product is compatible with a wide range of bus systems and can be easily integrated into existing setups.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and ensure reliable performance in various bus applications.

Technical Specifications

Bus Driver & Transceivers SN74AHC245MDWREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74AHC245MDWREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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