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SN74AHC14DRE4

Texas Instruments

SN74AHC14DRE4 by Texas Instruments

SN74AHC14DRE4 by Texas Instruments is a CMOS logic gate with 6 functions, 12 ns propagation delay at 3.3V. It operates in automotive grade conditions from -40 to 125°C, ideal for applications requiring Schmitt Trigger technology and a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 94,900 parts In-Stock

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Digiode

USA . 3,770 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 1,468 parts In-Stock

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$11.000

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$11.000

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Parana Technologies

USA . 1,900 parts In-Stock

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$16.517

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$16.799

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$16.517

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AZTECH Wire

Italy . 807 parts In-Stock

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$17.505

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DigiPath Technology Company

USA . 1,197 parts In-Stock

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$18.187

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$16.732

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ChromeModa Solutions

Germany . 2,813 parts In-Stock

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$18.558

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$15.218

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IDEA Electronic Components Group

UK . 1,475 parts In-Stock

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$18.558

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$17.630

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$16.702

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Corohmni

South Africa . 30 parts In-Stock

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One Stop Electronics

USA . 362 parts In-Stock

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Semicontronic

India . 1,401 parts In-Stock

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Corphita

USA . 1,918 parts In-Stock

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

USA . 455 parts In-Stock

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Advanced Electronics

New Zealand . 200 parts In-Stock

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Bastille Electronics

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Overview

Elevate your electronic designs with the SN74AHC14DRE4 by Texas Instruments, a high-quality logic gate that offers exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this versatile component is ideal for a wide range of applications in automotive and industrial settings. With its fast propagation delay and low power consumption, the SN74AHC14DRE4 delivers unmatched value and efficiency, making it the perfect choice for your next project. Trust Texas Instruments for cutting-edge technology and superior quality components that elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides good durability and resistance to damage, making the product robust for various applications.

Propagation Delay At Nominal Supply

12 ns - This low propagation delay ensures fast and efficient operation of the logic gates, making them ideal for time-sensitive tasks.

Surface Mount

YES - The surface mount design allows for easy and secure installation on circuit boards, saving space and simplifying assembly processes.

No. of Functions

6 - With multiple functions in a single package, this product offers versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V)

3.3 - The nominal supply voltage of 3.3V makes this product compatible with a wide range of systems and power sources.

Load Capacitance (CL)

50 pF - The low load capacitance reduces power consumption and interference, enhancing the overall performance of the logic gates.

Power Supplies (V)

2/5.5 - With a range of power supplies supported, this product can be used in diverse environments and configurations.

No. of Terminals

14 - The ample number of terminals provides flexibility in connection options and allows for complex circuit arrangements.

Package Style (Meter)

SMALL OUTLINE - The compact small outline package design saves space and enables high-density integration of components on the circuit board.

Maximum I (ol)

8 Amp - The high maximum output current capacity allows for driving a variety of loads, making this product versatile and powerful.

Propagation Delay (tpd)

18.5 ns - The low propagation delay ensures quick signal processing and reduces latency in the system, improving overall efficiency.

Maximum Operating Temperature

125 °C - The high maximum operating temperature range allows for reliable operation in harsh environmental conditions.

Minimum Operating Temperature

40 °C - The low minimum operating temperature range ensures reliable performance even in extreme cold environments.

Terminal Finish

Nickel/Palladium/Gold - The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance.

Terminal Position

DUAL - The dual terminal position allows for easier installation and secure connection, improving reliability in the system.

Maximum Seated Height

1.75 mm - The low maximum seated height enables a compact and space-efficient design, suitable for slim and compact devices.

Width

3.9 mm - The narrow width of the package saves space on the circuit board and allows for high-density mounting of components.

Minimum Supply Voltage (Vsup)

2 V - The low minimum supply voltage requirement allows for operation in low-power applications and extends the product's compatibility range.

Peak Reflow Temperature °C

260 - The high peak reflow temperature tolerance ensures reliable soldering during assembly processes, reducing the risk of component damage.

Length

8.65 mm - The moderate length of the package provides a balanced design for easy integration into various circuit layouts.

Temperature Grade

AUTOMOTIVE - This automotive-grade temperature tolerance ensures reliable performance in automotive applications with varying temperature conditions.

Schmitt Trigger

YES - The inclusion of a Schmitt trigger enhances the noise immunity and stability of the logic gates, ensuring accurate signal processing.

Technology

CMOS - The CMOS technology used in this product offers low power consumption and high noise immunity, making it suitable for energy-efficient and reliable applications.

Terminal Form

GULL WING - The gull-wing terminal form provides secure and stable connection points, reducing the risk of disconnection and improving overall reliability.

Packing Method

TR - The tape and reel packing method facilitates automated assembly processes, saving time and ensuring convenience during production.

Terminal Pitch

1.27 mm - The standard terminal pitch allows for compatibility with a wide range of PCB designs and ensures easy integration into existing systems.

Maximum Supply Voltage (Vsup)

5.5 V - The high maximum supply voltage tolerance provides flexibility in system design and compatibility with different power sources.

Maximum Power Supply Current (ICC)

0.02 mA - The low maximum power supply current consumption enhances energy efficiency and reduces operating costs for long-term use.

Technical Specifications

Logic Gates SN74AHC14DRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74AHC14DRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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