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SN74ACT244PWG4

Texas Instruments

SN74ACT244PWG4 by Texas Instruments

SN74ACT244PWG4 by Texas Instruments is a 20-terminal bus driver with 10ns propagation delay and 3-state output characteristics. It operates at a nominal voltage of 5V, suitable for industrial applications requiring fast signal transmission in compact spaces. The package style is small outline, thin profile, shrink pitch, making it ideal for surface mount designs with limited space constraints.

Median Price

$1.330

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 758 parts In-Stock

1+ parts

$1.330

100+ parts

$0.924

1k+ parts

$0.763

10k+ parts

$0.534

758

$1.330

$0.924

$0.763

$0.534

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,256 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

3,256

$1.264

-

-

-

Chip Stock

USA . 210,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210,470

-

-

-

-

Vyrian

USA . 5,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,714

-

-

-

-

Bristol Electronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.585

1k+ parts

-

10k+ parts

-

50

-

$0.585

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,390 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

3,390

$1.197

-

-

-

Parana Technologies

USA . 2,050 parts In-Stock

1+ parts

$20.164

100+ parts

-

1k+ parts

$20.111

10k+ parts

-

2,050

$20.164

-

$20.111

-

DigiPath Technology Company

USA . 501 parts In-Stock

1+ parts

$22.203

100+ parts

$20.427

1k+ parts

-

10k+ parts

-

501

$22.203

$20.427

-

-

IDEA Electronic Components Group

UK . 2,374 parts In-Stock

1+ parts

$22.656

100+ parts

$21.523

1k+ parts

$20.390

10k+ parts

-

2,374

$22.656

$21.523

$20.390

-

ChromeModa Solutions

Germany . 1,711 parts In-Stock

1+ parts

$22.656

100+ parts

$18.578

1k+ parts

-

10k+ parts

-

1,711

$22.656

$18.578

-

-

Microchip USA

USA . 1,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,828

-

-

-

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Perfect Parts

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Overview

Unlock seamless communication with the Texas Instruments SN74ACT244PWG4 Bus Driver & Transceivers. Crafted with precision and reliability, this product offers unparalleled quality and performance. Ideal for industrial applications, this versatile component boasts a range of benefits including fast propagation delay, low power consumption, and compact design. Elevate your projects with the value and efficiency that only Texas Instruments can provide. Trust in the SN74ACT244PWG4 to deliver seamless connectivity and superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protects the components inside, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 10 ns

With a low propagation delay, this product ensures fast and efficient signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable simplifies the installation process and allows for compact and space-saving designs in electronic systems.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional parts, leading to cost savings and simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage means compatibility with a wide range of systems and power sources.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style allows for high component density on a PCB, ideal for space-constrained applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can be used in harsh environments or applications that require operation in cold conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noise-prone environments.

Technical Specifications

Bus Driver & Transceivers SN74ACT244PWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74ACT244PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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