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SN74AC574DBR

Texas Instruments

SN74AC574DBR by Texas Instruments

SN74AC574DBR by Texas Instruments is an 8-bit bus driver with a supply voltage of 3.3V, featuring a propagation delay of 15ns and output characteristics in the form of 3-STATE. It is ideal for industrial applications requiring true output polarity, positive edge trigger type, and a max frequency of 60MHz at nominal voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,199 parts In-Stock

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Digiode

USA . 803 parts In-Stock

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803

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Distributors (Availability)

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Microchip USA

USA . 1,609 parts In-Stock

1+ parts

$2.767

100+ parts

-

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1,609

$2.767

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Andel Nordic

Denmark . 3,194 parts In-Stock

1+ parts

$4.101

100+ parts

-

1k+ parts

$3.937

10k+ parts

$3.937

3,194

$4.101

-

$3.937

$3.937

AZTECH Wire

Italy . 737 parts In-Stock

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$10.742

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737

$10.742

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One Stop Electronics

USA . 431 parts In-Stock

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$12.000

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431

$12.000

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Parana Technologies

USA . 320 parts In-Stock

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$20.918

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$21.113

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320

$20.918

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$21.113

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DigiPath Technology Company

USA . 531 parts In-Stock

1+ parts

$23.033

100+ parts

$21.190

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531

$23.033

$21.190

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ChromeModa Solutions

Germany . 1,582 parts In-Stock

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$23.503

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$19.272

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1,582

$23.503

$19.272

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IDEA Electronic Components Group

UK . 6 parts In-Stock

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$23.503

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$22.328

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$21.153

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6

$23.503

$22.328

$21.153

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Component Stockers USA

USA . 180,784 parts In-Stock

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$0.320

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$0.320

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$0.320

Perfect Parts

USA . 8,593 parts In-Stock

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Corphita

USA . 3,215 parts In-Stock

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Overview

Enhance your electronic projects with the SN74AC574DBR by Texas Instruments, a top-tier bus driver and transceiver that delivers unmatched quality and reliability. Crafted with precision by a renowned manufacturer, this product offers seamless integration and exceptional performance in various applications. With its advanced features and cutting-edge technology, customers can expect superior functionality and efficiency, making it the perfect choice for demanding projects. Elevate your designs to new heights with the SN74AC574DBR and experience the value and benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the bus driver/transceiver.

Surface Mount: YES

Makes it easy to integrate into circuit boards, saving space and simplifying the manufacturing process.

No. of Bits: 8

Provides sufficient data transmission capability for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common power supply voltages, ensuring easy integration into different systems.

Propagation Delay (tpd): 15 ns

Offers fast signal transmission, crucial for real-time data processing.

Output Characteristics: 3-STATE

Allows for the tri-state output, which provides flexibility in connecting multiple devices to the same bus.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74AC574DBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

60000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74AC574DBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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