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SN74AC573DWG4

Texas Instruments

SN74AC573DWG4 by Texas Instruments

SN74AC573DWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 15ns at 3V. It features a 3-STATE output and operates in industrial temperature range. Ideal for applications requiring true output polarity control and low enable type, it comes in a small outline package with dual terminals.

Median Price

$0.710

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 775 parts In-Stock

1+ parts

-

100+ parts

$0.710

1k+ parts

$0.589

10k+ parts

$0.525

775

-

$0.710

$0.589

$0.525

DigiKey

USA . 775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.500

10k+ parts

-

775

-

-

$0.500

-

Verical

USA . 775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.736

10k+ parts

$0.656

775

-

-

$0.736

$0.656

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,782 parts In-Stock

1+ parts

$0.457

100+ parts

-

1k+ parts

-

10k+ parts

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1,782

$0.457

-

-

-

Chip Stock

USA . 2,670 parts In-Stock

1+ parts

-

100+ parts

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2,670

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Vyrian

USA . 2,216 parts In-Stock

1+ parts

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2,216

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DigiKey Marketplace

USA . 775 parts In-Stock

1+ parts

-

100+ parts

$0.500

1k+ parts

-

10k+ parts

-

775

-

$0.500

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,944 parts In-Stock

1+ parts

$0.433

100+ parts

-

1k+ parts

-

10k+ parts

-

2,944

$0.433

-

-

-

Parana Technologies

USA . 857 parts In-Stock

1+ parts

$15.917

100+ parts

-

1k+ parts

$16.272

10k+ parts

-

857

$15.917

-

$16.272

-

DigiPath Technology Company

USA . 718 parts In-Stock

1+ parts

$17.526

100+ parts

-

1k+ parts

-

10k+ parts

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718

$17.526

-

-

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ChromeModa Solutions

Germany . 6,459 parts In-Stock

1+ parts

$17.884

100+ parts

$14.665

1k+ parts

-

10k+ parts

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6,459

$17.884

$14.665

-

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IDEA Electronic Components Group

UK . 1,048 parts In-Stock

1+ parts

$17.884

100+ parts

$16.990

1k+ parts

$16.096

10k+ parts

-

1,048

$17.884

$16.990

$16.096

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Perfect Parts

USA . 2,548 parts In-Stock

1+ parts

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2,548

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Microchip USA

USA . 1,785 parts In-Stock

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1,785

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Overview

Enhance the performance of your electronic devices with the SN74AC573DWG4 by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. As a Bus Driver & Transceiver, this product ensures seamless communication within your circuits, offering a fast propagation delay of 15 ns and a low load capacitance of 50 pF. With a true output polarity and 3-STATE output characteristics, this component guarantees efficiency in data transmission. Invest in the SN74AC573DWG4 and experience enhanced functionality, improved connectivity, and unmatched value for your applications. Upgrade your systems today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 15 ns

Low propagation delay ensures fast and efficient data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and making assembly more efficient.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage of 3V, making it compatible with a wide range of systems.

No. of Bits: 8

8-bit resolution provides sufficient data handling capability for various bus driver and transceiver applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact design and easy integration into tight spaces.

Technical Specifications

Bus Driver & Transceivers SN74AC573DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74AC573DWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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