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SN74AC564PW

Texas Instruments

SN74AC564PW by Texas Instruments

SN74AC564PW by Texas Instruments is an 8-bit bus driver with a propagation delay of 15.5 ns at 3.3V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85°C) with inverted output polarity, ideal for applications requiring independent control and positive edge triggering.

Median Price

$2.120

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 143 parts In-Stock

1+ parts

$2.120

100+ parts

$1.309

1k+ parts

$1.247

10k+ parts

-

143

$2.120

$1.309

$1.247

-

Mouser Electronics

USA . 805 parts In-Stock

1+ parts

$2.310

100+ parts

$1.560

1k+ parts

$1.190

10k+ parts

$1.020

805

$2.310

$1.560

$1.190

$1.020

Rochester

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

$1.300

10k+ parts

$1.160

70

-

$1.570

$1.300

$1.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,299 parts In-Stock

1+ parts

$1.036

100+ parts

-

1k+ parts

-

10k+ parts

-

1,299

$1.036

-

-

-

Vyrian

USA . 5,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,615

-

-

-

-

Martec Srl

Italy . 1,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,074

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 798 parts In-Stock

1+ parts

$0.981

100+ parts

-

1k+ parts

-

10k+ parts

-

798

$0.981

-

-

-

Component Stockers USA

USA . 246 parts In-Stock

1+ parts

$1.110

100+ parts

$1.630

1k+ parts

-

10k+ parts

-

246

$1.110

$1.630

-

-

Andel Nordic

Denmark . 5,560 parts In-Stock

1+ parts

$11.195

100+ parts

-

1k+ parts

$10.747

10k+ parts

$10.747

5,560

$11.195

-

$10.747

$10.747

Microchip USA

USA . 467 parts In-Stock

1+ parts

$15.210

100+ parts

$15.120

1k+ parts

$15.070

10k+ parts

$15.020

467

$15.210

$15.120

$15.070

$15.020

Parana Technologies

USA . 251 parts In-Stock

1+ parts

$27.253

100+ parts

-

1k+ parts

$33.785

10k+ parts

-

251

$27.253

-

$33.785

-

ChromeModa Solutions

Germany . 6,617 parts In-Stock

1+ parts

$30.621

100+ parts

$25.109

1k+ parts

-

10k+ parts

-

6,617

$30.621

$25.109

-

-

IDEA Electronic Components Group

UK . 77 parts In-Stock

1+ parts

$30.621

100+ parts

$29.090

1k+ parts

$27.559

10k+ parts

-

77

$30.621

$29.090

$27.559

-

DigiPath Technology Company

USA . 1,033 parts In-Stock

1+ parts

-

100+ parts

$27.608

1k+ parts

-

10k+ parts

-

1,033

-

$27.608

-

-

Overview

Enhance your electronic designs with the SN74AC564PW by Texas Instruments. With a focus on quality and precision, Texas Instruments delivers top-notch Bus Driver & Transceivers that cater to a variety of applications. This product not only provides reliable performance but also offers unmatched value to customers. Whether you're looking for efficient data transmission or seamless communication, the SN74AC564PW stands out with its advanced features and benefits. Upgrade your projects with this innovative solution and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 15.5 ns

The low propagation delay ensures fast signal transmission, making the product efficient and reliable.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and easily accessible, making the product compatible with a wide range of systems.

No. of Bits: 8

The 8-bit configuration provides sufficient data transmission capabilities for many applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows the product to function effectively even in harsh environmental conditions.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74AC564PW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

15.5 ns

Propagation Delay (tpd):

15.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74AC564PW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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