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SN74AC564DBR

Texas Instruments

SN74AC564DBR by Texas Instruments

SN74AC564DBR by Texas Instruments is an 8-bit bus driver with a propagation delay of 15.5 ns at 3.3V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85 °C) and supports independent control applications with inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,367 parts In-Stock

1+ parts

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7,367

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Digiode

USA . 4,119 parts In-Stock

1+ parts

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4,119

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,901 parts In-Stock

1+ parts

$5.415

100+ parts

-

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1,901

$5.415

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Parana Technologies

USA . 1,716 parts In-Stock

1+ parts

$21.113

100+ parts

-

1k+ parts

$21.375

10k+ parts

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1,716

$21.113

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$21.375

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DigiPath Technology Company

USA . 1,845 parts In-Stock

1+ parts

$23.249

100+ parts

$21.389

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1,845

$23.249

$21.389

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ChromeModa Solutions

Germany . 6,020 parts In-Stock

1+ parts

$23.723

100+ parts

$19.453

1k+ parts

-

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6,020

$23.723

$19.453

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

1+ parts

$23.723

100+ parts

$22.537

1k+ parts

$21.351

10k+ parts

-

1,745

$23.723

$22.537

$21.351

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Corphita

USA . 1,002 parts In-Stock

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1,002

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Overview

Upgrade your electronics projects with the high-quality SN74AC564DBR bus driver & transceiver by Texas Instruments. With a nominal supply voltage of 3.3V and a maximum operating temperature of 85°C, this versatile component is perfect for a wide range of applications. From industrial automation to consumer electronics, the SN74AC564DBR offers reliable performance and efficient signal transmission. Trust Texas Instruments for top-notch quality and innovation, and experience the value and benefits this product brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures that the product is resistant to damage and can withstand various environmental conditions, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 15.5 ns

The low propagation delay ensures that signals are transmitted quickly and efficiently, making the product suitable for high-performance applications where speed is crucial.

Surface Mount: YES

Being surface mountable allows for easy and compact integration onto circuit boards, saving space and simplifying the overall design of the system.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes the product compatible with a wide range of systems and power sources, increasing its versatility.

Output Characteristics: 3-STATE

The 3-state output allows for additional flexibility in controlling the signal flow, enabling more advanced circuit configurations and functionality.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74AC564DBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

15.5 ns

Propagation Delay (tpd):

15.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74AC564DBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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