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SN74ABTH245DGVRE4

Texas Instruments

SN74ABTH245DGVRE4 by Texas Instruments

SN74ABTH245DGVRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.6 ns at 5V, suitable for industrial applications. It features a max I (ol) of 64A, operates in temperatures ranging from -40 to 85°C, and has a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,773 parts In-Stock

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Vyrian

USA . 2,079 parts In-Stock

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2,079

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Distributors (Availability)

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Andel Nordic

Denmark . 1,838 parts In-Stock

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$10.043

100+ parts

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$9.642

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$9.642

1,838

$10.043

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$9.642

$9.642

AZTECH Wire

Italy . 697 parts In-Stock

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$10.230

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697

$10.230

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Parana Technologies

USA . 694 parts In-Stock

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$18.821

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$18.903

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$18.903

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DigiPath Technology Company

USA . 594 parts In-Stock

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$20.724

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594

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ChromeModa Solutions

Germany . 2,741 parts In-Stock

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$21.147

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$17.341

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IDEA Electronic Components Group

UK . 20 parts In-Stock

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$21.147

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$20.090

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$19.032

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20

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$19.032

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One Stop Electronics

USA . 1,242 parts In-Stock

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$53.000

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Corphita

USA . 1,635 parts In-Stock

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Microchip USA

USA . 266 parts In-Stock

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Overview

Experience seamless data transmission and superior signal integrity with the SN74ABTH245DGVRE4 by Texas Instruments. As a trusted leader in semiconductor manufacturing, Texas Instruments delivers cutting-edge Bus Driver & Transceiver solutions that ensure reliable performance in various applications. With fast propagation delay, low power consumption, and 3-state output characteristics, this product is designed to optimize efficiency and enhance overall system functionality. Trust Texas Instruments to provide top-quality components that meet your needs and exceed your expectations. Upgrade your technology today with the SN74ABTH245DGVRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand rugged use in a bus driver application.

Propagation Delay At Nominal Supply: 3.9 ns

The low propagation delay ensures quick and efficient signal transmission, making this product suitable for high-speed bus driver applications.

Surface Mount: YES

The ability to be surface mounted allows for easy and efficient installation of the bus driver transceiver in compact spaces within the bus.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most bus systems and simplifies the integration process.

Maximum I (ol): 64 Amp

The high output current capability of 64Amp allows for driving multiple loads or devices without the need for external amplification, enhancing the versatility of the product.

Output Characteristics: 3-STATE

The 3-STATE output feature enables the bus driver transceiver to control the bus lines effectively by driving them high, driving them low, or disconnecting them to prevent bus contention.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of the product ensures reliable operation in harsh environmental conditions typically encountered in bus systems, making it suitable for automotive applications.

Technical Specifications

Bus Driver & Transceivers SN74ABTH245DGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

Length:

5 mm

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74ABTH245DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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