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SN74ABT8652DLR

Texas Instruments

SN74ABT8652DLR by Texas Instruments

SN74ABT8652DLR by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.5 ns at 5V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and independent control for bidirectional communication in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,333 parts In-Stock

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3,333

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Vyrian

USA . 2,180 parts In-Stock

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2,180

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Distributors (Availability)

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Andel Nordic

Denmark . 3,419 parts In-Stock

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$10.262

100+ parts

-

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$9.851

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$9.851

3,419

$10.262

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$9.851

$9.851

AZTECH Wire

Italy . 687 parts In-Stock

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$15.214

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687

$15.214

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Parana Technologies

USA . 1,730 parts In-Stock

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$15.233

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$15.632

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1,730

$15.233

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$15.632

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DigiPath Technology Company

USA . 731 parts In-Stock

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$16.774

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$15.432

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731

$16.774

$15.432

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ChromeModa Solutions

Germany . 4,758 parts In-Stock

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$17.116

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$14.035

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4,758

$17.116

$14.035

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IDEA Electronic Components Group

UK . 367 parts In-Stock

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$17.116

100+ parts

$16.260

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$15.404

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367

$17.116

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$15.404

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One Stop Electronics

USA . 469 parts In-Stock

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$61.000

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469

$61.000

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QUARKTWIN TECHNOLOGY LTD

USA . 21,496 parts In-Stock

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Corphita

USA . 3,265 parts In-Stock

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Microchip USA

USA . 317 parts In-Stock

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Overview

Elevate your electronic designs with the SN74ABT8652DLR by Texas Instruments, a top-tier manufacturer known for delivering superior quality products. As a powerful bus driver and transceiver, this component ensures seamless data transmission across various devices. Its small outline and dual terminal position make it versatile for a wide range of applications. With fast propagation delay and independent control features, this product offers unmatched reliability and efficiency to customers looking to optimize their systems. Upgrade your projects today with the Texas Instruments SN74ABT8652DLR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and reliability for the product, making it suitable for long-term use.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast signal transmission, which is important for efficient bus driver operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration into circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly available voltage level, making it compatible with various systems.

Output Characteristics: 3-STATE

3-state output allows for high flexibility in signal control and connection to multiple devices.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in different environmental conditions.

Technology: BICMOS

BICMOS technology offers a good balance of speed and power consumption, suitable for bus driver applications.

Technical Specifications

Bus Driver & Transceivers SN74ABT8652DLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G28

Length:

9.525 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74ABT8652DLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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