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SN74ABT853PWG4

Texas Instruments

SN74ABT853PWG4 by Texas Instruments

SN74ABT853PWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.3 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85 °C) and supports independent control for bidirectional communication applications.

Median Price

$9.868

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$9.868

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-

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870

$9.868

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Vyrian

USA . 1,971 parts In-Stock

1+ parts

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1,971

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Digiode

USA . 1,244 parts In-Stock

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1,244

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 164 parts In-Stock

1+ parts

$9.013

100+ parts

-

1k+ parts

$8.653

10k+ parts

$8.653

164

$9.013

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$8.653

$8.653

AZTECH Wire

Italy . 540 parts In-Stock

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$17.236

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540

$17.236

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Parana Technologies

USA . 1,061 parts In-Stock

1+ parts

$26.325

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$26.926

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1,061

$26.325

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$26.926

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One Stop Electronics

USA . 883 parts In-Stock

1+ parts

$27.000

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883

$27.000

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DigiPath Technology Company

USA . 1,810 parts In-Stock

1+ parts

$28.987

100+ parts

$26.668

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1,810

$28.987

$26.668

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IDEA Electronic Components Group

UK . 1,407 parts In-Stock

1+ parts

$29.579

100+ parts

$28.100

1k+ parts

$26.621

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1,407

$29.579

$28.100

$26.621

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ChromeModa Solutions

Germany . 858 parts In-Stock

1+ parts

$29.579

100+ parts

$24.255

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858

$29.579

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Corphita

USA . 2,090 parts In-Stock

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Microchip USA

USA . 486 parts In-Stock

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Overview

Experience high-quality performance and reliability with the SN74ABT853PWG4 by Texas Instruments, a leading manufacturer in the industry. This Bus Driver & Transceiver offers unmatched value and benefits, making it perfect for a wide range of applications. With 8 bits and 2 functions, this product provides fast propagation delays, ensuring efficient data transmission. Whether you're in industrial automation or telecommunications, this product's 3-STATE output characteristics and independent control make it a versatile solution. Trust Texas Instruments to deliver top-notch products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 5.3 ns

The low propagation delay ensures fast signal transmission, making the product efficient and responsive.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, making the product suitable for compact designs.

No. of Functions: 2

The multiple functions provided by the product offer versatility and flexibility in its usage.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, the product is compatible with standard power sources and easy to integrate into existing systems.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance, enabling the product to control multiple buses and devices effectively.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range of -40 to 85°C ensures reliable operation in harsh environmental conditions.

Technology: BICMOS

Utilizing Bipolar CMOS technology offers a balance of high performance and low power consumption, making the product energy-efficient.

Technical Specifications

Bus Driver & Transceivers SN74ABT853PWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

5.3 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74ABT853PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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