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SN74ABT841ADBRE4

Texas Instruments

SN74ABT841ADBRE4 by Texas Instruments

SN74ABT841ADBRE4 by Texas Instruments is a 10-bit bus driver with 6.2 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and features a max operating temperature of 85°C. With surface mount capability and 3-STATE output characteristics, it offers efficient signal transmission in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,024 parts In-Stock

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Digiode

USA . 2,759 parts In-Stock

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2,759

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Distributors (Availability)

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AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$18.649

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212

$18.649

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One Stop Electronics

USA . 748 parts In-Stock

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$23.000

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748

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Parana Technologies

USA . 1,368 parts In-Stock

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$26.289

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$26.886

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1,368

$26.289

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$26.886

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DigiPath Technology Company

USA . 614 parts In-Stock

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$28.947

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$26.631

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614

$28.947

$26.631

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ChromeModa Solutions

Germany . 6,443 parts In-Stock

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$29.538

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$24.221

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6,443

$29.538

$24.221

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

1+ parts

$29.538

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$28.061

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$26.584

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1,951

$29.538

$28.061

$26.584

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Andel Nordic

Denmark . 5,128 parts In-Stock

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Corphita

USA . 3,533 parts In-Stock

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Microchip USA

USA . 1,559 parts In-Stock

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Overview

Enhance your electronic projects with the SN74ABT841ADBRE4 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable Bus Driver & Transceivers that provide seamless communication between components. With a nominal supply voltage of 5V and low propagation delay, this 10-bit device is perfect for applications requiring fast data transfer. The small outline package makes it easy to integrate into your designs, while the 3-STATE output characteristic offers flexibility. Trust Texas Instruments for high-performance solutions that add value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and ruggedness, making this product suitable for harsh environments and ensuring a long lifespan.

Propagation Delay At Nominal Supply: 6.2 ns

Low propagation delay ensures fast data transmission and efficient performance of the bus driver & transceivers.

Surface Mount: YES

Surface mount capability enables easy and convenient installation onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient placement on the PCB, optimizing the use of available space.

No. of Bits: 10

Having 10 bits allows for a wide range of data transmission and processing capabilities, making this product versatile and suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with many common electronic systems and power sources.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures stable and reliable signal transmission, preventing signal distortion and interference.

Power Supplies (V): 5

Operating at 5V power supplies provides consistent and reliable performance, making this product a dependable choice for various applications.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and integration with other components, enhancing the functionality of the product.

Maximum I (ol): 64 Amp

The high maximum output current of 64 Amps ensures that this product can drive and control a wide range of loads, making it suitable for diverse applications.

Technical Specifications

Bus Driver & Transceivers SN74ABT841ADBRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74ABT841ADBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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