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SN74ABT821ADWG4

Texas Instruments

SN74ABT821ADWG4 by Texas Instruments

SN74ABT821ADWG4 by Texas Instruments is a 10-bit bus driver with 6.7 ns propagation delay at 5V, ideal for industrial applications. It features a 3-STATE output, operates b/w -40 to 85 °C, and supports a max frequency of 125MHz. With dual terminal position and GULL WING form factor, it offers independent control in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,567 parts In-Stock

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3,567

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Vyrian

USA . 2,784 parts In-Stock

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2,784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 809 parts In-Stock

1+ parts

$12.956

100+ parts

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809

$12.956

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Parana Technologies

USA . 333 parts In-Stock

1+ parts

$21.344

100+ parts

-

1k+ parts

$21.672

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333

$21.344

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$21.672

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DigiPath Technology Company

USA . 2,340 parts In-Stock

1+ parts

$23.502

100+ parts

$21.622

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2,340

$23.502

$21.622

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ChromeModa Solutions

Germany . 2,476 parts In-Stock

1+ parts

$23.982

100+ parts

$19.665

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2,476

$23.982

$19.665

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IDEA Electronic Components Group

UK . 2,002 parts In-Stock

1+ parts

$23.982

100+ parts

$22.783

1k+ parts

$21.584

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2,002

$23.982

$22.783

$21.584

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One Stop Electronics

USA . 582 parts In-Stock

1+ parts

$36.000

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582

$36.000

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Corphita

USA . 4,293 parts In-Stock

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Microchip USA

USA . 2,679 parts In-Stock

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Overview

Elevate your electronic projects with the SN74ABT821ADWG4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability. Perfect for a wide range of applications, this product delivers seamless performance with a fast propagation delay of 6.7 ns. Experience the value of efficient data transmission and robust output characteristics with Texas Instruments' cutting-edge technology. Trust in the legacy of excellence that Texas Instruments brings to every component, and unlock the full potential of your designs with the SN74ABT821ADWG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, making it easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 6.7 ns

With a low propagation delay, the product ensures fast and efficient data transmission, making it ideal for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used in electronic components, making it compatible with standard PCB designs for easy integration.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this product is compatible with a wide range of electronic systems and ensures consistent performance.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF minimizes signal distortion and loss, ensuring reliable signal transmission in high-frequency applications.

Power Supplies (V): 5

The product operates within a standard power supply range of 5V, making it easy to integrate into existing electronic systems without the need for additional components.

No. of Terminals: 24

With 24 terminals, this product offers flexibility in connecting with other components and peripherals, allowing for versatile circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, enabling compact and efficient circuit board layouts for optimized system design.

Maximum I (ol): 64 Amp

With a maximum output current of 64A, this product can drive high-load devices or multiple bus lines, making it suitable for demanding applications.

Propagation Delay (tpd): 6.7 ns

The low propagation delay of 6.7 ns ensures fast signal transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high-temperature environments, ensuring reliable operation in various applications.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance when disabled, preventing signal interference and ensuring clean signal transmission in multi-driver systems.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise signal timing and synchronization, making it suitable for applications that require accurate data transmission.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can operate in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability in various operating conditions.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connections, minimizing the risk of signal interference and improving overall system stability.

No. of Ports: 2

With 2 ports, this product can support multiple communication channels or devices simultaneously, increasing system versatility and flexibility.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm allows for compact and slim device designs, saving space and enabling sleek and portable products.

Width: 7.5 mm

The narrow width of 7.5 mm facilitates PCB layout and integration, allowing for dense and efficient circuit board designs.

Output Polarity: TRUE

Having true output polarity ensures consistent signal behavior, preventing signal inversion and maintaining signal integrity in data transmission.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this product can operate effectively even when the power supply drops slightly, ensuring reliable performance in fluctuating conditions.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for lead-free soldering processes, meeting industry standards for environmentally friendly manufacturing.

Length: 15.4 mm

The compact length of 15.4 mm enables space-efficient PCB layout and design, contributing to streamlined product development and manufacturing.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh operating conditions, ensuring reliable performance in demanding environments.

Maximum Frequency At Nominal Supply: 125000000 Hz

Operating at a high maximum frequency of 125MHz, this product is suitable for high-speed data communication and processing tasks, ensuring efficient performance in advanced applications.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high-speed operation, low power consumption, and robust performance for versatile applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering on the PCB, ensuring secure connections and reliable signal transmission in electronic systems.

Packing Method: TUBE

The tube packing method offers convenient storage and transportation of the product, protecting it from damage and ensuring easy handling in manufacturing processes.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density PCB layout and compact designs, enabling efficient use of space in electronic applications.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction ensures consistent signal transmission in one direction, simplifying system design and avoiding signal conflicts in multi-driver setups.

Control Type: INDEPENDENT CONTROL

The independent control feature allows for individual management of different functions or ports, offering flexibility and customization options for diverse system requirements.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a safe range of 5.5V, this product can withstand supply voltage variations without compromising performance, ensuring reliable operation in dynamic environments.

Maximum Power Supply Current (ICC): 38 mA

The low maximum power supply current of 38mA minimizes power consumption and heat generation, improving energy efficiency and reliability in continuous operation.

Technical Specifications

Bus Driver & Transceivers SN74ABT821ADWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

125000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74ABT821ADWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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