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SN74ABT540PWR

Texas Instruments

SN74ABT540PWR by Texas Instruments

SN74ABT540PWR by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.8 ns, operating temperature range of -40 to 85 °C. It features a small outline package and is ideal for industrial applications requiring inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,053 parts In-Stock

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5,053

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Digiode

USA . 4,481 parts In-Stock

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4,481

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Distributors (Availability)

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Andel Nordic

Denmark . 5,190 parts In-Stock

1+ parts

$1.642

100+ parts

-

1k+ parts

$1.577

10k+ parts

$1.577

5,190

$1.642

-

$1.577

$1.577

AZTECH Wire

Italy . 339 parts In-Stock

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$12.520

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339

$12.520

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Parana Technologies

USA . 50 parts In-Stock

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$14.140

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-

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$14.601

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50

$14.140

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$14.601

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ChromeModa Solutions

Germany . 4,815 parts In-Stock

1+ parts

$15.888

100+ parts

$13.028

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4,815

$15.888

$13.028

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IDEA Electronic Components Group

UK . 1,089 parts In-Stock

1+ parts

$15.888

100+ parts

$15.094

1k+ parts

$14.299

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1,089

$15.888

$15.094

$14.299

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One Stop Electronics

USA . 427 parts In-Stock

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$36.000

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427

$36.000

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A-Z Elektronik GmbH

Germany . 5,025 parts In-Stock

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Corphita

USA . 4,330 parts In-Stock

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Microchip USA

USA . 1,815 parts In-Stock

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1,815

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DigiPath Technology Company

USA . 1,216 parts In-Stock

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$14.325

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1,216

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$14.325

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Overview

Texas Instruments' SN74ABT540PWR is a top-of-the-line Bus Driver & Transceiver that offers unparalleled quality and reliability. With a compact design and advanced technology, this product provides customers with fast and efficient data transmission across 8 bits. Perfect for industrial applications, the SN74ABT540PWR guarantees optimal performance even in extreme temperatures, making it a valuable asset for any project. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the bus driver & transceivers.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving space and making the product suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with common power sources, making it convenient for integration into various electronic systems.

Propagation Delay (tpd): 4.8 ns

With a low propagation delay of 4.8ns, this product offers fast signal transmission, enhancing overall performance and efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enables the product to withstand harsh environmental conditions, ensuring reliability in different applications.

Output Polarity: INVERTED

Having an inverted output polarity can be beneficial for specific circuit configurations, providing flexibility in design and compatibility with various systems.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, resulting in high-speed performance and low power consumption for the product.

Technical Specifications

Bus Driver & Transceivers SN74ABT540PWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74ABT540PWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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