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SN74ABT540PW

Texas Instruments

SN74ABT540PW by Texas Instruments

SN74ABT540PW by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.8 ns at 5V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity is inverted, and has a terminal pitch of 0.635 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,098 parts In-Stock

1+ parts

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5,098

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Digiode

USA . 2,778 parts In-Stock

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2,778

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 540 parts In-Stock

1+ parts

$8.563

100+ parts

-

1k+ parts

$8.220

10k+ parts

$8.220

540

$8.563

-

$8.220

$8.220

AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$12.615

100+ parts

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478

$12.615

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Parana Technologies

USA . 1,538 parts In-Stock

1+ parts

$22.764

100+ parts

-

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$23.430

10k+ parts

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1,538

$22.764

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$23.430

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ChromeModa Solutions

Germany . 6,177 parts In-Stock

1+ parts

$25.578

100+ parts

$20.974

1k+ parts

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6,177

$25.578

$20.974

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IDEA Electronic Components Group

UK . 358 parts In-Stock

1+ parts

$25.578

100+ parts

$24.299

1k+ parts

$23.020

10k+ parts

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358

$25.578

$24.299

$23.020

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One Stop Electronics

USA . 1,513 parts In-Stock

1+ parts

$45.000

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1,513

$45.000

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Corphita

USA . 2,943 parts In-Stock

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2,943

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Microchip USA

USA . 2,722 parts In-Stock

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2,722

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DigiPath Technology Company

USA . 2,288 parts In-Stock

1+ parts

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100+ parts

$23.061

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2,288

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$23.061

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Overview

Enhance your electronic designs with the SN74ABT540PW by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This bus driver & transceiver is perfect for applications requiring fast data transmission and efficient signal routing. With a low propagation delay of 4.8 ns and 3-STATE output characteristics, this product offers unmatched performance. Trust in Texas Instruments to deliver cutting-edge technology that meets industrial standards and provides value to customers seeking high-quality components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 4.8 ns

The low propagation delay ensures fast and efficient communication within the bus system.

Surface Mount: YES

The ability to be surface mounted makes installation and assembly easier and more efficient.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures compatibility with a wide range of devices and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to be used in industrial environments with varying temperature conditions.

Technology: BICMOS

The BICMOS technology offers a combination of high-speed performance and low power consumption, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74ABT540PW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SN74ABT540PW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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