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SN74ABT2244ANSRE4

Texas Instruments

SN74ABT2244ANSRE4 by Texas Instruments

SN74ABT2244ANSRE4 by Texas Instruments is a 20-terminal bus driver with 5.6 ns propagation delay and 12 Amp max I (ol). It operates at a nominal voltage of 5V, suitable for industrial applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,857 parts In-Stock

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3,857

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Vyrian

USA . 3,509 parts In-Stock

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3,509

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Distributors (Availability)

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Andel Nordic

Denmark . 4,260 parts In-Stock

1+ parts

$7.334

100+ parts

-

1k+ parts

$7.041

10k+ parts

$7.041

4,260

$7.334

-

$7.041

$7.041

AZTECH Wire

Italy . 650 parts In-Stock

1+ parts

$12.367

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650

$12.367

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One Stop Electronics

USA . 143 parts In-Stock

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$26.000

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143

$26.000

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Parana Technologies

USA . 1,327 parts In-Stock

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$28.704

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$50.780

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1,327

$28.704

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$50.780

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DigiPath Technology Company

USA . 304 parts In-Stock

1+ parts

$31.607

100+ parts

$29.078

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304

$31.607

$29.078

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ChromeModa Solutions

Germany . 3,188 parts In-Stock

1+ parts

$32.252

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$26.447

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3,188

$32.252

$26.447

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IDEA Electronic Components Group

UK . 1,003 parts In-Stock

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$32.252

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$30.639

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$29.027

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1,003

$32.252

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$29.027

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Microchip USA

USA . 1,713 parts In-Stock

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Corphita

USA . 1,499 parts In-Stock

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Overview

Enhance your electronic projects with the SN74ABT2244ANSRE4 by Texas Instruments, a top-quality Bus Driver & Transceiver offering unmatched performance and reliability. Designed with cutting-edge BICMOS technology, this product ensures seamless communication with a propagation delay of just 5.6 ns. Ideal for industrial applications, this device features a compact design and a wide operating temperature range. Say goodbye to compatibility issues and enjoy smooth data transmission with this versatile solution. Upgrade your projects today with Texas Instruments' outstanding innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product, making it suitable for use in various environments.

Propagation Delay At Nominal Supply: 5.6 ns

Low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation and assembly convenient, saving time and effort during production.

No. of Functions: 2

Having multiple functions in a single package enhances the versatility and functionality of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into existing electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with common power sources.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance and signal integrity in different circuit configurations.

Power Supplies (V): 5

Consistent power supply of 5V ensures reliable operation and prevents voltage fluctuations.

No. of Terminals: 20

Having a sufficient number of terminals allows for easy connection and integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and makes this product suitable for compact electronic designs.

Maximum I (ol): 12 Amp

High output current capability of 12A allows this product to drive heavy loads and handle power efficiently.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40 to 85°C ensures reliability in extreme environments.

Technology: BICMOS

BICMOS technology provides a balance between Bipolar and CMOS characteristics, offering high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74ABT2244ANSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

5.6 ns

Propagation Delay (tpd):

5.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74ABT2244ANSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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