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SN74ABT125DE4

Texas Instruments

SN74ABT125DE4 by Texas Instruments

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$1.520

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 323 parts In-Stock

1+ parts

$1.520

100+ parts

$0.713

1k+ parts

$0.440

10k+ parts

$0.431

323

$1.520

$0.713

$0.440

$0.431

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$0.468

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$0.468

-

-

-

Digiode

USA . 3,977 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

3,977

$0.940

-

-

-

Chip Stock

USA . 19,300 parts In-Stock

1+ parts

-

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19,300

-

-

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Vyrian

USA . 2,472 parts In-Stock

1+ parts

-

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-

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-

10k+ parts

-

2,472

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,475 parts In-Stock

1+ parts

$0.468

100+ parts

-

1k+ parts

-

10k+ parts

$0.458

2,475

$0.468

-

-

$0.458

Argo Parts USA

USA . 1,347 parts In-Stock

1+ parts

$0.468

100+ parts

-

1k+ parts

-

10k+ parts

$0.454

1,347

$0.468

-

-

$0.454

Corphita

USA . 4,887 parts In-Stock

1+ parts

$0.891

100+ parts

-

1k+ parts

-

10k+ parts

-

4,887

$0.891

-

-

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Andel Nordic

Denmark . 3,478 parts In-Stock

1+ parts

$1.280

100+ parts

-

1k+ parts

$1.229

10k+ parts

$1.229

3,478

$1.280

-

$1.229

$1.229

Ampacity Inc.

Singapore . 131 parts In-Stock

1+ parts

$1.370

100+ parts

-

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131

$1.370

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Corohmni

South Africa . 323 parts In-Stock

1+ parts

$11.870

100+ parts

-

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323

$11.870

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AZTECH Wire

Italy . 479 parts In-Stock

1+ parts

$16.415

100+ parts

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479

$16.415

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Parana Technologies

USA . 353 parts In-Stock

1+ parts

$21.161

100+ parts

-

1k+ parts

$21.441

10k+ parts

-

353

$21.161

-

$21.441

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DigiPath Technology Company

USA . 323 parts In-Stock

1+ parts

$23.300

100+ parts

$21.436

1k+ parts

-

10k+ parts

-

323

$23.300

$21.436

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ChromeModa Solutions

Germany . 2,378 parts In-Stock

1+ parts

$23.776

100+ parts

$19.496

1k+ parts

-

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2,378

$23.776

$19.496

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$23.776

100+ parts

$22.587

1k+ parts

$21.398

10k+ parts

-

2,322

$23.776

$22.587

$21.398

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Microchip USA

USA . 1,109 parts In-Stock

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1,109

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Perfect Parts

USA . 530 parts In-Stock

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530

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Technical Specifications

Bus Driver & Transceivers SN74ABT125DE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74ABT125DE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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