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SN55LVDS31W

Texas Instruments

SN55LVDS31W by Texas Instruments

SN55LVDS31W by Texas Instruments is a CMOS line driver with 4 functions, operating at 3.3V. It features a max transmit delay of 4.5ns and differential output, suitable for EIA-644/TIA-644 interface standards in military-grade applications. With a compact flatpack package style and surface-mount compatibility, it offers high-speed signal transmission with low power consumption.

Median Price

$27.043

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,822 parts In-Stock

1+ parts

$31.002

100+ parts

$27.558

1k+ parts

$20.263

10k+ parts

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4,822

$31.002

$27.558

$20.263

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Avnet

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$23.084

1k+ parts

$22.446

10k+ parts

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7

-

$23.084

$22.446

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,622 parts In-Stock

1+ parts

$29.452

100+ parts

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1,622

$29.452

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Vyrian

USA . 3,207 parts In-Stock

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3,207

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

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200

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 182 parts In-Stock

1+ parts

$9.871

100+ parts

-

1k+ parts

$10.443

10k+ parts

-

182

$9.871

-

$10.443

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DigiPath Technology Company

USA . 2,042 parts In-Stock

1+ parts

$10.869

100+ parts

$10.000

1k+ parts

-

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2,042

$10.869

$10.000

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AZTECH Wire

Italy . 1,120 parts In-Stock

1+ parts

$10.930

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-

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1,120

$10.930

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ChromeModa Solutions

Germany . 5,999 parts In-Stock

1+ parts

$11.091

100+ parts

$9.095

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-

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5,999

$11.091

$9.095

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IDEA Electronic Components Group

UK . 375 parts In-Stock

1+ parts

$11.091

100+ parts

$10.536

1k+ parts

$9.982

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375

$11.091

$10.536

$9.982

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Ampacity Inc.

Singapore . 4,551 parts In-Stock

1+ parts

$26.350

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4,551

$26.350

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Corphita

USA . 2,136 parts In-Stock

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$27.902

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2,136

$27.902

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Lixinc

USA . 11,482 parts In-Stock

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11,482

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,484 parts In-Stock

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3,484

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Microchip USA

USA . 2,670 parts In-Stock

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2,670

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance your electronic designs with the SN55LVDS31W by Texas Instruments. Crafted with precision using high-quality materials, this line driver & receiver offers unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures seamless communication and data transmission. Experience the value of superior technology with the SN55LVDS31W, providing customers with unmatched benefits and advantages. Elevate your projects with Texas Instruments, the trusted manufacturer known for delivering top-notch solutions.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components, making it suitable for rugged environments.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

No. of Functions: 4

Having 4 functions in one unit increases functionality and reduces the need for multiple separate components, saving space and cost.

Maximum Transmit Delay: 4.5 ns

The low maximum transmit delay ensures fast and efficient signal transmission, crucial for time-sensitive applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for tri-state logic operations.

Temperature Grade: MILITARY

The military-grade temperature range makes this product suitable for extreme conditions and ensures reliable performance in harsh environments.

Input Characteristics: STANDARD

Having standard input characteristics ensures compatibility with a wide range of devices and systems, making integration seamless.

Interface Standard: EIA-644; TIA-644

Compliance with industry-standard interface standards ensures interoperability and ease of use with other compatible devices.

Technical Specifications

Line Drivers & Receivers SN55LVDS31W attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.25

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2.03 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

4.5 ns

Width:

6.73 mm

Trade Compliance

SN55LVDS31W Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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