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SN54HC08VTDF2

Texas Instruments

SN54HC08VTDF2 by Texas Instruments

Texas Instruments SN54HC08VTDF2 is a CMOS logic gate with 4 functions and 2 inputs. It comes in a rectangular package with 14 terminals, suitable for surface mount applications. Ideal for digital circuit design requiring logical operations in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,796 parts In-Stock

1+ parts

-

100+ parts

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5,796

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Digiode

USA . 4,010 parts In-Stock

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-

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-

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4,010

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 649 parts In-Stock

1+ parts

$7.453

100+ parts

-

1k+ parts

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10k+ parts

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649

$7.453

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One Stop Electronics

USA . 1,406 parts In-Stock

1+ parts

$16.000

100+ parts

-

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1,406

$16.000

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Parana Technologies

USA . 1,106 parts In-Stock

1+ parts

$25.488

100+ parts

-

1k+ parts

$26.112

10k+ parts

-

1,106

$25.488

-

$26.112

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DigiPath Technology Company

USA . 286 parts In-Stock

1+ parts

$28.065

100+ parts

$25.820

1k+ parts

-

10k+ parts

-

286

$28.065

$25.820

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ChromeModa Solutions

Germany . 3,882 parts In-Stock

1+ parts

$28.638

100+ parts

$23.483

1k+ parts

-

10k+ parts

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3,882

$28.638

$23.483

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IDEA Electronic Components Group

UK . 646 parts In-Stock

1+ parts

$28.638

100+ parts

$27.206

1k+ parts

$25.774

10k+ parts

-

646

$28.638

$27.206

$25.774

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Microchip USA

USA . 1,592 parts In-Stock

1+ parts

$114.460

100+ parts

$111.410

1k+ parts

$109.880

10k+ parts

$108.350

1,592

$114.460

$111.410

$109.880

$108.350

Corphita

USA . 2,775 parts In-Stock

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2,775

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Overview

Unlock the power of precision and reliability with the SN54HC08VTDF2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality logic gates that are perfect for a wide range of applications. With four functions and two inputs, this surface mount chip offers seamless integration and superior performance. Say goodbye to inefficiencies and hello to enhanced productivity with the SN54HC08VTDF2. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Being surface mount compatible makes it easy to integrate this product onto circuit boards, saving space and reducing installation time.

No. of Functions: 4

Having multiple functions in one component helps simplify circuit design and reduce the number of components needed, leading to cost savings and improved efficiency.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed, making this product versatile for a variety of applications.

Package Shape: RECTANGULAR

A rectangular package shape is commonly used and easy to work with, allowing for easy mounting and integration within circuit designs.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting to other components and allows for more complex circuit designs to be implemented.

Package Style (Meter): UNCASED CHIP

An uncased chip package style offers a compact and efficient design, making it suitable for applications where space is limited.

Terminal Position: UPPER

Having terminals positioned at the upper side makes it easier to connect and integrate into circuit designs, improving overall usability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for use in various electronic devices.

Terminal Form: NO LEAD

A no-lead terminal form eliminates the need for soldering, simplifying the installation process and reducing the risk of damage to the product during assembly.

Packing Method: TUBE

Packaging the product in tubes provides protection during shipping and storage, ensuring that the product arrives in optimal condition and is ready for use.

Technical Specifications

Logic Gates SN54HC08VTDF2 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-XUUC-N14

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Packing Method:

TUBE

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

SN54HC08VTDF2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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