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SN54LS01W-10

Texas Instruments

SN54LS01W-10 by Texas Instruments

SN54LS01W-10 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 28 ns and operates at temperatures up to 125°C. This device is commonly used in military applications due to its MILITARY temperature grade.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,012 parts In-Stock

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Digiode

USA . 3,750 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 976 parts In-Stock

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$9.000

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$9.000

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One Stop Electronics

USA . 1,591 parts In-Stock

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$14.000

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Corohmni

South Africa . 175 parts In-Stock

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$14.350

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$14.350

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AZTECH Wire

Italy . 384 parts In-Stock

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$15.318

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$15.318

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Parana Technologies

USA . 72 parts In-Stock

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$18.519

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$18.631

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72

$18.519

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ChromeModa Solutions

Germany . 2,123 parts In-Stock

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$20.808

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$17.063

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IDEA Electronic Components Group

UK . 842 parts In-Stock

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$20.808

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$19.768

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$18.727

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842

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Continental Prestige Electronics

USA . 6,963 parts In-Stock

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Argo Parts USA

USA . 2,010 parts In-Stock

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Aranea Global

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DigiPath Technology Company

USA . 1,247 parts In-Stock

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Corphita

USA . 1,062 parts In-Stock

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Overview

Experience excellence with the SN54LS01W-10 by Texas Instruments, the leading manufacturer of high-quality logic gates. This versatile product offers customers a wide range of applications and unbeatable value. With its advanced technology and reliable performance, the SN54LS01W-10 provides precise results at lightning-fast speeds. Say goodbye to delays and hello to efficiency. Whether you're in the military sector or require industrial-grade solutions, this product delivers exceptional results. Trust Texas Instruments for all your logic gate needs and experience the advantage of cutting-edge technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Superior material composition enhances durability and reliability for long-term usage.

Surface Mount: YES

Compatible with modern circuit board designs, offering easy integration and space-saving benefits.

No. of Functions: 4

Provides multiple logical operations for versatile applications and complex systems.

No. of Inputs: 2

Ideal for simple logic calculations and basic control functions.

Package Shape: RECTANGULAR

Compact shape allows for efficient space utilization in electronic circuits and systems.

Nominal Supply Voltage / Vsup (V): 5

Designed to operate optimally with a constant supply voltage of 5V, ensuring consistent and stable performance.

Load Capacitance (CL): 15 pF

Suitable for circuits with moderate capacitive loads, ensuring efficient signal transmission.

No. of Terminals: 14

Sufficient number of terminals for easy connectivity and flexibility during circuit assembly.

Package Style (Meter): FLATPACK

Flatpack design facilitates easy soldering and enhances thermal dissipation.

Propagation Delay (tpd): 28 ns

Low propagation delay ensures rapid and efficient signal processing, enabling high-speed operation.

Maximum Operating Temperature: 125 °C

Can withstand high-temperature environments, making it suitable for demanding applications.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with other digital components and systems.

Minimum Operating Temperature: -55 °C

Capable of functioning reliably in extremely low-temperature conditions.

Terminal Position: DUAL

Dual-terminal position provides flexibility in circuit board design and installation.

Maximum Seated Height: 2.03 mm

Sleek profile enables compatibility with compact electronic devices, contributing to space-saving solutions.

Width: 6.29 mm

Narrow width allows for efficient placement and integration in tight circuit layouts.

Minimum Supply Voltage (Vsup): 4.5 V

Wide supply voltage range accommodates various power systems, increasing adaptability.

Length: 9.21 mm

Compact length promotes efficient utilization of available space in electronic assemblies.

Temperature Grade: MILITARY

Designed to meet the stringent temperature requirements of military-grade applications.

Technology: TTL

Utilizes transistor-transistor logic, a proven and reliable technology for digital circuitry.

Terminal Form: FLAT

Flat terminal design ensures secure soldering and reliable electrical connections.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates compatibility with widely used circuit board architectures.

Maximum Supply Voltage (Vsup): 5.5 V

Wide maximum supply voltage range ensures compatibility with different power sources.

Maximum Power Supply Current (ICC): 4.4 mA

Low power supply current consumption allows for efficient energy usage and extends battery life.

Technical Specifications

Logic Gates SN54LS01W-10 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

4.4 mA

Propagation Delay (tpd):

28 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.29 mm

Trade Compliance

SN54LS01W-10 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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