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SN54ALS251J

Texas Instruments

SN54ALS251J by Texas Instruments

SN54ALS251J by Texas Instruments is an 8-input multiplexer with a propagation delay of 24 ns at 5V. It operates in a temperature range of -55 to 125°C and features TTL technology. Ideal for military-grade applications requiring high-speed data switching.

Median Price

$6.554

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Freelance Electronics

USA . 6 parts In-Stock

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$6.554

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$6.881

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Vyrian

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Digiode

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Sogenti Electronics

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LWI Electronics Inc

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Holdelec - ElecDif-Pro

France . 21 parts In-Stock

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PAR Electronics

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Resion

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AZTECH Wire

Italy . 531 parts In-Stock

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$8.455

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One Stop Electronics

USA . 959 parts In-Stock

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Parana Technologies

USA . 2,261 parts In-Stock

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$13.364

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DigiPath Technology Company

USA . 233 parts In-Stock

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ChromeModa Solutions

Germany . 277 parts In-Stock

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IDEA Electronic Components Group

UK . 60 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,713 parts In-Stock

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Microchip USA

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Overview

Experience top-notch quality and reliability with the SN54ALS251J by Texas Instruments, a leading manufacturer in the industry. This multiplexer & demultiplexer offers seamless performance and versatility for a wide range of applications. With its efficient design and innovative technology, this product provides exceptional value and benefits to customers seeking high-quality components. Trust Texas Instruments to deliver excellence in every aspect, making your projects smoother and more efficient with the SN54ALS251J.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Propagation Delay at Nominal Supply: 24 ns

The low propagation delay ensures fast transmission of data, making this multiplexer/demultiplexer suitable for applications that require quick signal processing.

No. of Inputs: 8

With 8 inputs, this multiplexer/demultiplexer offers versatility and flexibility in handling multiple input signals efficiently.

Nominal Supply Voltage: 5V

Operating at a standard 5V supply voltage, this product can easily integrate into existing circuit designs without the need for additional power adaptations.

Output Characteristics: 3-STATE

The 3-state output allows the multiplexer/demultiplexer to disconnect the output terminal, providing flexibility in controlling the output signal and reducing the chances of signal interference.

Technical Specifications

Multiplexer & Demultiplexer SN54ALS251J attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

34 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54ALS251J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-283-6634, 5962012836634

NIIN

012836634

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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