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SN54ALS112AJ

Texas Instruments

SN54ALS112AJ by Texas Instruments

SN54ALS112AJ by Texas Instruments is a TTL technology latch with 2 functions, 18 ns propagation delay, and 5V nominal voltage. It is used in military-grade applications for negative edge triggering, with a max frequency of 25 MHz at nominal supply.

Median Price

$5.552

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 40 parts In-Stock

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Bristol Electronics

USA . 24 parts In-Stock

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$8.960

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Vyrian

USA . 6,009 parts In-Stock

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Digiode

USA . 986 parts In-Stock

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Electronic Expediters

USA . 74 parts In-Stock

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Manotoh

Italy . 6 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Parana Technologies

USA . 165 parts In-Stock

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$11.621

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$12.017

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DigiPath Technology Company

USA . 1,783 parts In-Stock

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$12.796

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ChromeModa Solutions

Germany . 3,950 parts In-Stock

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$13.057

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$10.707

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IDEA Electronic Components Group

UK . 964 parts In-Stock

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$13.057

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$12.404

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$11.751

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964

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AZTECH Wire

Italy . 497 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

USA . 4,670 parts In-Stock

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Corphita

USA . 3,642 parts In-Stock

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Assy Fe

Spain . 1,025 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 77 parts In-Stock

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Overview

Elevate your electronic projects with the SN54ALS112AJ by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile latches & flip-flops category product offers unmatched reliability and performance. Perfect for a wide range of applications, this component provides exceptional value and benefits to customers looking for seamless integration and efficiency in their designs. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection to the internal components, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 18 ns

Fast signal propagation allows for quick response times in digital circuitry.

No. of Functions: 2

Multiple functions in one component offer increased functionality and efficiency.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making integration into existing systems easy.

Maximum Operating Temperature: 125 °C

Suitable for use in a wide range of environments and applications.

Technology: TTL

Uses transistor-transistor logic for reliable and robust operation.

Technical Specifications

Latches & Flip-Flops SN54ALS112AJ attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Maximum I (ol):

-.4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

4 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

6.92 mm

Minimum fmax:

34 MHz

Trade Compliance

SN54ALS112AJ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-287-6842, 5962012876842

NIIN

012876842

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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