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SN54ALS00AJ

Texas Instruments

SN54ALS00AJ by Texas Instruments

SN54ALS00AJ by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 15 ns at 5V, suitable for military-grade applications. The package is ceramic, glass-sealed, with through-hole terminals and a max operating temperature of 125°C.

Median Price

$12.746

Lifecycle Status

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29

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1k+

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Chip1Stop

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Rochester

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$11.330

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DigiKey

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Verical

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Freelance Electronics

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Digiode

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TEDSS.com

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Vyrian

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Classic Components Corporation

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ComSIT Distribution GmbH

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Beltway Electronics Company

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Sogenti Electronics

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Elcom Components

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Mil-Aero Solutions, Inc.

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Sunrise Surplus Inc.

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PAR Electronics

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Corphita

USA . 2,263 parts In-Stock

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Component Stockers USA

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Parana Technologies

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DigiPath Technology Company

USA . 1,883 parts In-Stock

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ChromeModa Solutions

Germany . 4,239 parts In-Stock

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IDEA Electronic Components Group

UK . 941 parts In-Stock

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A-Z Elektronik GmbH

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Microchip USA

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Overview

Enhance your electronic projects with the SN54ALS00AJ logic gates from Texas Instruments, a trusted manufacturer known for top-quality components. These versatile logic gates offer fast propagation delay and low power consumption, making them ideal for a wide range of applications in digital circuits. Whether you're a hobbyist or a professional, you'll appreciate the reliability and performance that this product brings to your designs. Upgrade your projects today with the SN54ALS00AJ and experience the difference that quality components can make.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body material ensures durability and protects the internal components from external factors, making this product long-lasting.

Propagation Delay At Nominal Supply: 15 ns

With a fast propagation delay of 15 ns, this logic gate allows for quick signal processing and high-speed operation.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with most electronic circuits and systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures up to 125°C, ensuring reliable performance in various environmental conditions.

Technology: TTL

Utilizes TTL technology, known for its high-speed operation and low power consumption, making it an efficient choice for logic gate applications.

Technical Specifications

Logic Gates SN54ALS00AJ attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

3 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN54ALS00AJ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-375-2529, 5962013752529, 5962-99-251-4852, 5962992514852

NIIN

013752529, 992514852

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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