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RM48L940DZWTT

Texas Instruments

RM48L940DZWTT by Texas Instruments

Texas Instruments RM48L940DZWTT microcontroller features 32-bit architecture, 22-bit address bus, and 8-bit on-chip data RAM. Ideal for industrial applications, it offers 24 ADC channels, 16 DMA channels, and connectivity options like CAN, Ethernet, I2C, SCI, and SPI. Operating at up to 80 MHz with low power mode support.

Median Price

$41.344

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,775 parts In-Stock

1+ parts

$30.779

100+ parts

$27.359

1k+ parts

$20.117

10k+ parts

-

5,775

$30.779

$27.359

$20.117

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Mouser Electronics

USA . 70 parts In-Stock

1+ parts

$51.910

100+ parts

$38.930

1k+ parts

-

10k+ parts

-

70

$51.910

$38.930

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 928 parts In-Stock

1+ parts

$29.240

100+ parts

-

1k+ parts

-

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928

$29.240

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Vyrian

USA . 8,688 parts In-Stock

1+ parts

-

100+ parts

-

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8,688

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,182 parts In-Stock

1+ parts

$8.510

100+ parts

-

1k+ parts

-

10k+ parts

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1,182

$8.510

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-

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Corphita

USA . 2,522 parts In-Stock

1+ parts

$27.701

100+ parts

-

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2,522

$27.701

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Parana Technologies

USA . 791 parts In-Stock

1+ parts

$72.741

100+ parts

-

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791

$72.741

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-

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DigiPath Technology Company

USA . 1,347 parts In-Stock

1+ parts

$80.097

100+ parts

-

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10k+ parts

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1,347

$80.097

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-

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IDEA Electronic Components Group

UK . 1,971 parts In-Stock

1+ parts

$81.732

100+ parts

$77.645

1k+ parts

$73.559

10k+ parts

-

1,971

$81.732

$77.645

$73.559

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ChromeModa Solutions

Germany . 584 parts In-Stock

1+ parts

$81.732

100+ parts

$67.020

1k+ parts

-

10k+ parts

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584

$81.732

$67.020

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Overview

Unlock the power of cutting-edge technology with the RM48L940DZWTT microcontroller from Texas Instruments. Built with precision and quality in mind, this device offers unparalleled performance and reliability for a wide range of applications. Whether you're a seasoned developer or a tech enthusiast, this product delivers exceptional value with its advanced features, efficient design, and seamless connectivity options. Elevate your projects to new heights with the RM48L940DZWTT and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers due to its durability and cost-effectiveness.

Maximum Supply Voltage: 1.32 V

A higher maximum supply voltage can provide flexibility in power supply options for different applications.

ROM Words: 3145728

With a large ROM memory size, this microcontroller can store a significant amount of program data.

Maximum Clock Frequency: 80 MHz

A high clock frequency allows for fast processing speeds, making this microcontroller suitable for demanding tasks.

Connectivity: CAN(3), ETHERNET, I2C, SCI(2), SPI(5)

The multiple connectivity options make this microcontroller versatile and compatible with various communication protocols.

Low Power Mode: YES

The low power mode feature helps in reducing energy consumption, making this microcontroller energy-efficient.

Technical Specifications

Microcontrollers RM48L940DZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

144

No. of Serial I/Os:

7

No. of Terminals:

337

No. of Timers:

41

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM48L940DZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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