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RM48L550PGET

Texas Instruments

RM48L550PGET by Texas Instruments

RM48L550PGET by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU family, featuring 16-bit address and external data bus width. With a max clock frequency of 80 MHz, it offers 44 I/O lines and ADC/DMA channels for industrial applications requiring high-speed processing and control capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,226 parts In-Stock

1+ parts

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5,226

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Digiode

USA . 4,053 parts In-Stock

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4,053

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$18.889

100+ parts

-

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195

$18.889

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One Stop Electronics

USA . 241 parts In-Stock

1+ parts

$26.000

100+ parts

-

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241

$26.000

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Parana Technologies

USA . 392 parts In-Stock

1+ parts

$47.324

100+ parts

$4,394.748

1k+ parts

$42.592

10k+ parts

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392

$47.324

$4,394.748

$42.592

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DigiPath Technology Company

USA . 1,232 parts In-Stock

1+ parts

$52.110

100+ parts

$47.941

1k+ parts

-

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1,232

$52.110

$47.941

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ChromeModa Solutions

Germany . 4,309 parts In-Stock

1+ parts

$53.173

100+ parts

$43.602

1k+ parts

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4,309

$53.173

$43.602

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IDEA Electronic Components Group

UK . 1,386 parts In-Stock

1+ parts

$53.173

100+ parts

$50.514

1k+ parts

$47.856

10k+ parts

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1,386

$53.173

$50.514

$47.856

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Corphita

USA . 3,319 parts In-Stock

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3,319

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Microchip USA

USA . 333 parts In-Stock

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333

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Overview

Unlock the power of innovation with the Texas Instruments RM48L550PGET microcontroller. Crafted with precision and expertise, this cutting-edge device boasts unparalleled quality and reliability that only a renowned manufacturer like Texas Instruments can provide. Ideal for a wide range of applications, this microcontroller offers unmatched value, benefits, and advantages to customers looking to elevate their projects to new heights. Experience seamless performance, enhanced functionality, and limitless possibilities with the RM48L550PGET microcontroller by Texas Instruments.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protects the microcontroller from external elements, making it a reliable choice for various applications.

Surface Mount YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage 1.32 V

A high maximum supply voltage ensures compatibility with a wide range of voltage inputs, making the microcontroller versatile in different operating conditions.

Address Bus Width 16

A wider address bus allows for efficient memory access and data transfer within the microcontroller, improving overall performance.

Package Shape SQUARE

Square package shape facilitates easier PCB layout and integration, optimizing space usage and enhancing design flexibility.

Bit Size 32

32-bit architecture offers enhanced processing capabilities, enabling the microcontroller to handle complex operations and algorithms efficiently.

Power Supplies (V) 1.2,3.3

Support for multiple power supply voltages provides flexibility in design and operation, allowing the microcontroller to function in various power environments.

No. of Terminals 144

A higher number of terminals enables more connections and interfaces, expanding the microcontroller's capabilities for interfacing with external devices and peripherals.

Package Style (Meter) FLATPACK, LOW PROFILE, FINE PITCH

Various package styles offer different mounting options to suit specific application requirements, enhancing compatibility and ease of integration.

Minimum Supply Voltage 1.14 V

A low minimum supply voltage allows the microcontroller to operate efficiently in low-power scenarios, conserving energy and extending battery life.

Maximum Operating Temperature 105 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments and industrial settings, making the microcontroller suitable for demanding applications.

CPU Family CORTEX-R4F

The Cortex-R4F CPU family offers high processing power and performance efficiency, making the microcontroller ideal for real-time applications that require rapid data processing.

Minimum Operating Temperature -40 °C

Low minimum operating temperature tolerance allows the microcontroller to operate in extreme cold conditions, ensuring reliability in a wide range of temperature environments.

Terminal Finish NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

ADC Channels YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its functionality in data acquisition and processing applications.

DMA Channels YES

Direct memory access channels enhance data transfer efficiency and reduce CPU workload, improving overall system performance and responsiveness.

Terminal Position QUAD

Quad terminal position offers multiple mounting options for secure and stable connections, ensuring reliable operation in diverse applications.

ROM Words 2097152

Large ROM capacity allows for storing extensive program code and data, enabling the microcontroller to support complex algorithms and applications.

Maximum Seated Height 1.6 mm

Low seated height facilitates slim and compact designs, reducing overall PCB thickness and enabling space-saving integration in tight layouts.

Width 20 mm

Compact width dimensions provide versatility in PCB layout and design, allowing the microcontroller to be embedded in various electronic devices and systems.

External Data Bus Width 16

Wide external data bus width enables fast data transfer and efficient communication between the microcontroller and external memory devices, enhancing overall system performance.

Maximum Clock Frequency 80 MHz

High maximum clock frequency enables rapid data processing and execution of instructions, enhancing the microcontroller's performance in time-critical applications.

Maximum Time At Peak Reflow Temperature (s) 30

Optimal reflow temperature exposure time ensures proper soldering and connection reliability during PCB assembly, enhancing the microcontroller's overall operational stability.

Peak Reflow Temperature °C 260

High peak reflow temperature tolerance ensures proper solder joint formation and PCB assembly integrity, making the microcontroller suitable for reflow soldering processes.

Length 20 mm

Compact length dimensions offer flexibility in PCB design and placement, allowing the microcontroller to be employed in space-constrained applications.

Temperature Grade INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making the microcontroller suitable for industrial automation and control applications.

Peripheral IC Type MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and power efficiency, enhancing the microcontroller's ability to handle complex tasks and calculations efficiently.

RAM Bytes 196608

Large RAM capacity allows for efficient data storage and access, enabling the microcontroller to support multitasking and memory-intensive applications.

Technology CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in demanding operating conditions.

Terminal Form GULL WING

Gull wing terminal form offers secure solder connections and ease of PCB assembly, ensuring reliable electrical connections and operational stability.

Nominal Supply Voltage 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, supporting optimal performance and system reliability.

PWM Channels YES

Pulse-width modulation channels provide precise control over analog signals and motor speed, enhancing the microcontroller's capability in motor control and power management applications.

ROM Programmability FLASH

Flash programmable ROM enables easy and quick firmware updates and reprogramming, enhancing the microcontroller's flexibility and adaptability to changing application requirements.

Terminal Pitch 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB designs, enabling efficient space utilization and integration in miniaturized electronic devices.

Moisture Sensitivity Level (MSL) 3

Moisture sensitivity level 3 indicates moderate resistance to moisture-related damage during storage and handling, ensuring the microcontroller's reliability and durability in various environmental conditions.

Speed 200 rpm

High speed capability enables faster data processing and system response times, making the microcontroller suitable for high-performance applications that require rapid data handling.

No. of I/O Lines 44

Abundant I/O lines offer versatile connectivity options for interfacing with external devices and peripherals, enhancing the microcontroller's flexibility and functionality in diverse applications.

Technical Specifications

Microcontrollers RM48L550PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY

Address Bus Width:

16

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

RM48L550PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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