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RM48L950PGET

Texas Instruments

RM48L950PGET by Texas Instruments

RM48L950PGET by Texas Instruments is a 32-bit microcontroller with Cortex-R4F CPU family, offering 262144 bytes of RAM and 3145728 ROM words. It operates at a max clock frequency of 80 MHz and has PWM channels for precise control applications. With an industrial temperature grade range from -40 to 105 °C, it is suitable for various embedded systems requiring high-speed processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,707 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Digiode

USA . 505 parts In-Stock

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AZTECH Wire

Italy . 403 parts In-Stock

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$11.976

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One Stop Electronics

USA . 1,103 parts In-Stock

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$14.000

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Ampacity Inc.

Singapore . 1,358 parts In-Stock

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$35.000

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Corohmni

South Africa . 422 parts In-Stock

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$49.368

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Parana Technologies

USA . 200 parts In-Stock

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$73.592

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DigiPath Technology Company

USA . 119 parts In-Stock

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$81.034

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$74.552

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ChromeModa Solutions

Germany . 5,945 parts In-Stock

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$82.688

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$67.804

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IDEA Electronic Components Group

UK . 908 parts In-Stock

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$74.419

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QUARKTWIN TECHNOLOGY LTD

USA . 28,580 parts In-Stock

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Continental Prestige Electronics

USA . 4,858 parts In-Stock

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Corphita

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Microchip USA

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Argo Parts USA

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Aranea Global

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Overview

Experience the power and precision of the RM48L950PGET by Texas Instruments, a cutting-edge microcontroller designed to deliver unmatched performance in industrial applications. With its advanced technology and innovative features, this microcontroller offers customers exceptional value and benefits. Trust in Texas Instruments' reputation for quality and reliability as you harness the full potential of this versatile device. Upgrade your projects with the RM48L950PGET and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs during production.

Maximum Supply Voltage: 1.32 V

This low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Bit Size: 32

Having a 32-bit architecture enables the microcontroller to handle larger data sets and perform more complex calculations, increasing its processing power.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with a wide range of electronic devices.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows the microcontroller to measure and convert analog signals into digital data, enabling accurate sensor interfacing.

DMA Channels: YES

Direct Memory Access channels enable data transfer between peripherals and memory without CPU intervention, improving overall system performance and efficiency.

ROM Words: 3145728

With a large amount of Read-Only Memory, the microcontroller can store a substantial amount of program data and instructions, enhancing its versatility and functionality.

RAM Bytes: 262144

Having a generous amount of Random Access Memory allows for efficient data storage and manipulation during program execution, enhancing the microcontroller's operational capabilities.

Maximum Clock Frequency: 80 MHz

Operating at a high clock frequency enables the microcontroller to execute instructions quickly and handle time-sensitive tasks, making it suitable for applications requiring fast processing speeds.

ROM Programmability: FLASH

The use of Flash memory for ROM allows for in-system programmability, facilitating firmware updates and customization without needing to replace the microcontroller.

Technical Specifications

Microcontrollers RM48L950PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

10

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

RM48L950PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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