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RM48L952PGET

Texas Instruments

RM48L952PGET by Texas Instruments

Texas Instruments RM48L952PGET is a 32-bit microcontroller with Cortex-R4F CPU family. It operates at a max clock frequency of 80 MHz and has 262144 bytes of RAM. Ideal for industrial applications, it features ADC and DMA channels, along with PWM support.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,510 parts In-Stock

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Vyrian

USA . 2,991 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1 parts In-Stock

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AZTECH Wire

Italy . 488 parts In-Stock

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$6.668

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488

$6.668

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One Stop Electronics

USA . 1,287 parts In-Stock

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$10.000

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$12.923

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$11.760

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$10.597

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$12.923

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Parana Technologies

USA . 2,197 parts In-Stock

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$21.897

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$22.389

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$22.389

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DigiPath Technology Company

USA . 737 parts In-Stock

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$24.111

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$22.182

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737

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ChromeModa Solutions

Germany . 6,914 parts In-Stock

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$24.603

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$20.174

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IDEA Electronic Components Group

UK . 1,515 parts In-Stock

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$23.373

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Ampacity Inc.

Singapore . 937 parts In-Stock

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Corohmni

South Africa . 854 parts In-Stock

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Corphita

USA . 4,519 parts In-Stock

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Aranea Global

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Argo Parts USA

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Microchip USA

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Perfect Parts

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Continental Prestige Electronics

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Overview

Experience the cutting-edge technology of the RM48L952PGET microcontroller by Texas Instruments, a trusted industry leader known for superior quality and innovation. Ideal for a wide range of applications, this powerful 32-bit device offers exceptional performance and reliability. With features like ADC channels, PWM channels, and DMA channels, it provides unmatched versatility for your projects. Benefit from its low profile package design and industrial-grade temperature rating, making it perfect for demanding environments. Upgrade your designs with the value and benefits this advanced microcontroller brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.32 V

Can operate at a relatively high supply voltage, providing flexibility in power supply options.

Bit Size: 32

Offers a wide data processing capability, allowing for complex calculations and operations to be executed efficiently.

No. of Terminals: 144

Provides a sufficient number of terminals for connecting to various external devices and components, making the microcontroller versatile in its applications.

Minimum Operating Temperature: -40 °C

Can function reliably in extreme cold temperatures, expanding the range of environments in which the microcontroller can be used.

Maximum Clock Frequency: 80 MHz

Operates at a high clock frequency, enabling fast data processing and response times for real-time applications.

RAM Bytes: 262144

Provides a large amount of random access memory for storing and accessing data during operation, increasing the microcontroller's ability to handle complex tasks.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Maximum Supply Current: 400 mA

Requires a relatively low supply current, reducing power consumption and heat dissipation, contributing to overall energy efficiency.

Technical Specifications

Microcontrollers RM48L952PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

10

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

220 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

RM48L952PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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