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RM48L530ZWTT

Texas Instruments

RM48L530ZWTT by Texas Instruments

The Texas Instruments RM48L530ZWTT microcontroller features a 32-bit Cortex-R4F CPU with 196608 bytes of RAM and 2097152 ROM words. It operates at a max clock frequency of 80 MHz, suitable for industrial applications requiring high-speed processing. With ADC and DMA channels, this microcontroller offers versatile peripheral IC functionality in a compact square package with low profile and fine pitch terminals.

Median Price

$29.734

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$29.734

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10

$29.734

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Vyrian

USA . 3,499 parts In-Stock

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3,499

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Digiode

USA . 420 parts In-Stock

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420

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AZTECH Wire

Italy . 657 parts In-Stock

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$13.147

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One Stop Electronics

USA . 1,181 parts In-Stock

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$20.000

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Parana Technologies

USA . 2,143 parts In-Stock

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$35.435

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IDEA Electronic Components Group

UK . 816 parts In-Stock

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$39.815

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$37.824

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$35.834

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816

$39.815

$37.824

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ChromeModa Solutions

Germany . 461 parts In-Stock

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$39.815

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$32.648

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461

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Corphita

USA . 2,820 parts In-Stock

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2,820

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DigiPath Technology Company

USA . 1,164 parts In-Stock

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$35.897

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Microchip USA

USA . 402 parts In-Stock

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Overview

Unlock the power of innovation with the RM48L530ZWTT microcontroller from Texas Instruments. Known for their top-notch quality and cutting-edge technology, this microcontroller is perfect for a wide range of applications. With its advanced features and high performance capabilities, customers can expect seamless operation and optimal results. Experience the value and benefits that Texas Instruments brings to the table with this versatile and reliable microcontroller. Elevate your projects to new heights with the RM48L530ZWTT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body which helps in protecting the microcontroller.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards, saving space and facilitating automated assembly.

Maximum Supply Voltage: 1.32 V

Allows for a higher supply voltage which can improve performance in certain applications.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and performance for the microcontroller.

Power Supplies (V): 1.2,3.3

Multiple power supply options allow for flexibility in different power requirements of the system.

No. of Terminals: 337

High number of terminals provide ample connectivity options for interfacing with external components.

Maximum Operating Temperature: 105 °C

Wide operating temperature range makes the microcontroller suitable for industrial applications with varying temperature conditions.

CPU Family: CORTEX-R4F

Belonging to the CORTEX-R4F family ensures high processing power and reliability in real-time applications.

Maximum Clock Frequency: 80 MHz

High clock frequency allows for fast execution of instructions and efficient operation of the microcontroller.

ROM Words: 2097152

Large ROM capacity allows for storing a significant amount of program and data, enabling complex functionalities.

RAM Bytes: 196608

Generous RAM capacity provides ample space for data storage and manipulation, enhancing the processing capabilities.

Technical Specifications

Microcontrollers RM48L530ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQURIES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

RM48L530ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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