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PGA308AIDGSRG4

Texas Instruments

PGA308AIDGSRG4 by Texas Instruments

PGA308AIDGSRG4 by Texas Instruments is a 10-terminal analog circuit IC with dual terminal position. It operates at -40 to 125 °C and requires a supply voltage of 2.7-5.5 V, making it suitable for automotive applications. The package is small outline, thin profile, shrink pitch with gull wing terminals and square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,234 parts In-Stock

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4,234

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Digiode

USA . 702 parts In-Stock

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702

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Distributors (Availability)

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One Stop Electronics

USA . 1,307 parts In-Stock

1+ parts

$1.500

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1,307

$1.500

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Semicontronic

India . 1,436 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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1,436

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 547 parts In-Stock

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$8.143

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547

$8.143

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Parana Technologies

USA . 1,880 parts In-Stock

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$15.370

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$15.759

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1,880

$15.370

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$15.759

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DigiPath Technology Company

USA . 853 parts In-Stock

1+ parts

$16.925

100+ parts

$15.571

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853

$16.925

$15.571

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ChromeModa Solutions

Germany . 5,087 parts In-Stock

1+ parts

$17.270

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$14.161

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$17.270

$14.161

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IDEA Electronic Components Group

UK . 1,339 parts In-Stock

1+ parts

$17.270

100+ parts

$16.406

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$15.543

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1,339

$17.270

$16.406

$15.543

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Component Stockers USA

USA . 2,516 parts In-Stock

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$46.040

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2,516

$46.040

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Corphita

USA . 4,210 parts In-Stock

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4,210

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Microchip USA

USA . 2,032 parts In-Stock

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2,032

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Corohmni

South Africa . 445 parts In-Stock

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445

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Overview

Elevate your electronic designs with the PGA308AIDGSRG4 by Texas Instruments, a leading manufacturer known for superior quality and reliability. This versatile semiconductor is perfect for a wide range of applications in the automotive industry and beyond. With its compact size, low power consumption, and precise analog circuitry, this product offers unmatched value and performance to customers seeking top-notch solutions for their projects. Experience the benefits of cutting-edge technology with the PGA308AIDGSRG4 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability to the package, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Allows for stable operation at a common voltage level.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Can operate in low temperature conditions as well.

No. of Channels: 2

Provides flexibility and functionality for multi-channel applications.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature performance and reliability.

Technical Specifications

Other Function Semiconductors PGA308AIDGSRG4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

PGA308AIDGSRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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