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PGA300ARHHT

Texas Instruments

PGA300ARHHT by Texas Instruments

PGA300ARHHT by Texas Instruments is a 36-terminal chip carrier with a temperature range of -40 to 150°C. It operates on a supply voltage b/w 3.3V to 30V, suitable for automotive applications due to its no-lead terminal form and moisture sensitivity level of 2. The package style includes heat sink/slug in a square shape with dimensions of 6mm x 6mm.

Median Price

$7.439

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 750 parts In-Stock

1+ parts

$7.478

100+ parts

$6.096

1k+ parts

$4.064

10k+ parts

-

750

$7.478

$6.096

$4.064

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.400

10k+ parts

$7.287

250

-

-

$7.400

$7.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,173 parts In-Stock

1+ parts

$7.104

100+ parts

-

1k+ parts

-

10k+ parts

-

1,173

$7.104

-

-

-

Vyrian

USA . 4,809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,809

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 386 parts In-Stock

1+ parts

$6.360

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$6.360

-

-

-

Semicontronic

India . 213 parts In-Stock

1+ parts

$6.360

100+ parts

$6.201

1k+ parts

$6.169

10k+ parts

-

213

$6.360

$6.201

$6.169

-

Corphita

USA . 4,163 parts In-Stock

1+ parts

$6.730

100+ parts

-

1k+ parts

-

10k+ parts

-

4,163

$6.730

-

-

-

Corohmni

South Africa . 483 parts In-Stock

1+ parts

$7.478

100+ parts

-

1k+ parts

-

10k+ parts

-

483

$7.478

-

-

-

Parana Technologies

USA . 696 parts In-Stock

1+ parts

$22.028

100+ parts

-

1k+ parts

$22.581

10k+ parts

-

696

$22.028

-

$22.581

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DigiPath Technology Company

USA . 1,828 parts In-Stock

1+ parts

$24.256

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$24.256

-

-

-

ChromeModa Solutions

Germany . 3,597 parts In-Stock

1+ parts

$24.751

100+ parts

$20.296

1k+ parts

-

10k+ parts

-

3,597

$24.751

$20.296

-

-

IDEA Electronic Components Group

UK . 682 parts In-Stock

1+ parts

$24.751

100+ parts

$23.513

1k+ parts

$22.276

10k+ parts

-

682

$24.751

$23.513

$22.276

-

Overview

Elevate your electronic designs with the PGA300ARHHT by Texas Instruments, a top-quality semiconductor that offers unmatched precision and reliability. Manufactured by industry leader Texas Instruments, this chip carrier package delivers exceptional performance in a wide range of applications. With a maximum operating temperature of 150°C and a minimum supply voltage of 3.3V, this analog circuit is ideal for automotive use. Trust in the expertise of Texas Instruments and experience the value and benefits of the PGA300ARHHT in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic or epoxy package body material is lightweight, cost-effective, and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability enables easy and efficient assembly on printed circuit boards, saving space and allowing for automated manufacturing processes.

Package Shape: SQUARE

Square package shape provides uniformity in design and facilitates easier placement and orientation during assembly.

No. of Terminals: 36

Having 36 terminals allows for multiple connections and functionalities, making the product versatile for various circuit designs.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliability and performance in harsh environmental conditions, such as automotive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Maximum Supply Voltage: 30 V

High maximum supply voltage capability makes the product suitable for applications requiring higher voltage levels.

Technical Specifications

Other Function Semiconductors PGA300ARHHT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

PGA300ARHHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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