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PGA308TDD2

Texas Instruments

PGA308TDD2 by Texas Instruments

PGA308TDD2 by Texas Instruments is a 12-terminal analog circuit IC with 2 channels. It operates b/w 2.7V to 5.5V, making it suitable for various applications requiring precision signal processing in compact spaces due to its small dimensions of 1.828mm width and 2.132mm length in a surface-mount rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,381 parts In-Stock

1+ parts

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6,381

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Digiode

USA . 3,691 parts In-Stock

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3,691

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,546 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

1,546

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 753 parts In-Stock

1+ parts

$4.500

100+ parts

-

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753

$4.500

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Ampacity Inc.

Singapore . 973 parts In-Stock

1+ parts

$6.500

100+ parts

-

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973

$6.500

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Parana Technologies

USA . 2,237 parts In-Stock

1+ parts

$6.681

100+ parts

-

1k+ parts

$7.380

10k+ parts

-

2,237

$6.681

-

$7.380

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ChromeModa Solutions

Germany . 1,154 parts In-Stock

1+ parts

$7.507

100+ parts

$6.156

1k+ parts

-

10k+ parts

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1,154

$7.507

$6.156

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IDEA Electronic Components Group

UK . 1,021 parts In-Stock

1+ parts

$7.507

100+ parts

-

1k+ parts

$6.756

10k+ parts

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1,021

$7.507

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$6.756

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AZTECH Wire

Italy . 675 parts In-Stock

1+ parts

$8.562

100+ parts

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675

$8.562

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QUARKTWIN TECHNOLOGY LTD

USA . 13,134 parts In-Stock

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13,134

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Corphita

USA . 4,082 parts In-Stock

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4,082

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DigiPath Technology Company

USA . 1,483 parts In-Stock

1+ parts

-

100+ parts

$6.768

1k+ parts

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10k+ parts

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1,483

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$6.768

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Corohmni

South Africa . 105 parts In-Stock

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105

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Overview

Enhance your electronic designs with the PGA308TDD2 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions in the Other Function Semiconductors category. This versatile chip offers a wide range of applications and is surface mountable for easy integration. With 2 channels and a minimum supply voltage of 2.7V, the PGA308TDD2 provides exceptional value and performance for all your analog circuit needs. Upgrade your projects today with Texas Instruments' PGA308TDD2.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes it easy to integrate into electronic circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape is commonly used in electronic components and allows for easy placement and alignment on the PCB.

No. of Terminals: 12

Having 12 terminals allows for multiple connections and functionalities within a single component, increasing versatility.

Package Style (Meter): UNCASED CHIP

Uncased chip design provides flexibility in circuit design and allows for customization based on specific requirements.

Terminal Position: UPPER

Upper terminal position makes it convenient for connections and ensures better signal integrity in the circuit.

Width (mm): 1.828 mm

Compact width of 1.828mm enables high-density mounting on the PCB, suitable for miniaturized electronic devices.

Other IC type: ANALOG CIRCUIT

Analog circuit IC type offers precise control and processing of analog signals, making it ideal for applications requiring accurate signal manipulation.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage of 2.7V allows for operation in energy-efficient devices and extends battery life.

Length: 2.132 mm

Length of 2.132mm provides a compact footprint, enabling space-saving integration in small electronic systems.

No. of Channels: 2

Dual-channel functionality allows for simultaneous processing of multiple signals, enhancing the overall performance of the product.

Terminal Form: NO LEAD

No lead terminals eliminate the risk of soldering errors and improve reliability in the assembly process.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and operating conditions.

Technical Specifications

Other Function Semiconductors PGA308TDD2 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-XUUC-N12

Length:

2.132 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

12

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.828 mm

Trade Compliance

PGA308TDD2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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