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PGA308AIDGSTG4

Texas Instruments

PGA308AIDGSTG4 by Texas Instruments

PGA308AIDGSTG4 by Texas Instruments is a 10-terminal analog circuit IC with a supply voltage range of 2.7V to 5.5V, operating b/w -40°C to 125°C. It comes in a small outline package with gull wing terminals suitable for automotive applications requiring precise signal processing and control functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,882 parts In-Stock

1+ parts

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5,882

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Digiode

USA . 908 parts In-Stock

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908

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,285 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,285

$0.500

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Semicontronic

India . 656 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

656

$0.500

$0.488

$0.485

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AZTECH Wire

Italy . 826 parts In-Stock

1+ parts

$6.804

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826

$6.804

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One Stop Electronics

USA . 136 parts In-Stock

1+ parts

$7.500

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-

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136

$7.500

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Parana Technologies

USA . 1,496 parts In-Stock

1+ parts

$14.851

100+ parts

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$15.278

10k+ parts

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1,496

$14.851

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$15.278

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DigiPath Technology Company

USA . 1,857 parts In-Stock

1+ parts

$16.352

100+ parts

$15.044

1k+ parts

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1,857

$16.352

$15.044

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ChromeModa Solutions

Germany . 2,287 parts In-Stock

1+ parts

$16.686

100+ parts

$13.683

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2,287

$16.686

$13.683

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IDEA Electronic Components Group

UK . 1,132 parts In-Stock

1+ parts

$16.686

100+ parts

$15.852

1k+ parts

$15.017

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1,132

$16.686

$15.852

$15.017

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Corphita

USA . 1,479 parts In-Stock

1+ parts

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1,479

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Corohmni

South Africa . 420 parts In-Stock

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420

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Overview

Experience superior quality and performance with the PGA308AIDGSTG4 by Texas Instruments, a leading manufacturer in the semiconductor industry. This versatile product falls under the category of Other Function Semiconductors and is perfect for a wide range of applications. With its small outline, thin profile package style and dual terminal position, this IC offers unmatched value and benefits to customers. From automotive to industrial applications, this product delivers reliability and efficiency, making it a must-have for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in semiconductors for its durability and heat resistance, ensuring the product has a long lifespan and can operate at high temperatures.

Surface Mount: YES

Surface mount technology allows for easier PCB assembly, leading to faster production and potentially lower costs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage level of 5V makes this product compatible with many other electronic components and systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for use in demanding environments and applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets specific industry requirements for reliability and performance in vehicles.

Technical Specifications

Other Function Semiconductors PGA308AIDGSTG4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

PGA308AIDGSTG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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