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PGA308AIDGST

Texas Instruments

PGA308AIDGST by Texas Instruments

PGA308AIDGST by Texas Instruments is a 10-terminal analog circuit IC with 2 channels. It operates b/w -40 to 125 °C and requires a supply voltage of 2.7-5.5 V, making it suitable for automotive applications due to its small outline package shape and surface mount capability.

Median Price

$5.930

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 66,890 parts In-Stock

1+ parts

$4.349

100+ parts

$3.811

1k+ parts

$2.153

10k+ parts

-

66,890

$4.349

$3.811

$2.153

-

DigiKey

USA . 4,267 parts In-Stock

1+ parts

$5.930

100+ parts

$3.820

1k+ parts

$3.475

10k+ parts

$3.344

4,267

$5.930

$3.820

$3.475

$3.344

Mouser Electronics

USA . 1,898 parts In-Stock

1+ parts

$5.930

100+ parts

$3.830

1k+ parts

$3.330

10k+ parts

-

1,898

$5.930

$3.830

$3.330

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,463 parts In-Stock

1+ parts

$2.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,463

$2.830

-

-

-

Digiode

USA . 3,098 parts In-Stock

1+ parts

$4.132

100+ parts

-

1k+ parts

-

10k+ parts

-

3,098

$4.132

-

-

-

LWI Electronics Inc

India . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,432 parts In-Stock

1+ parts

$3.914

100+ parts

-

1k+ parts

-

10k+ parts

-

2,432

$3.914

-

-

-

Continental Prestige Electronics

USA . 156 parts In-Stock

1+ parts

$5.240

100+ parts

$3.500

1k+ parts

-

10k+ parts

-

156

$5.240

$3.500

-

-

Parana Technologies

USA . 2,226 parts In-Stock

1+ parts

$19.877

100+ parts

-

1k+ parts

$19.830

10k+ parts

-

2,226

$19.877

-

$19.830

-

DigiPath Technology Company

USA . 1,874 parts In-Stock

1+ parts

$21.887

100+ parts

$20.136

1k+ parts

-

10k+ parts

-

1,874

$21.887

$20.136

-

-

IDEA Electronic Components Group

UK . 2,160 parts In-Stock

1+ parts

$22.334

100+ parts

$21.217

1k+ parts

$20.101

10k+ parts

-

2,160

$22.334

$21.217

$20.101

-

ChromeModa Solutions

Germany . 361 parts In-Stock

1+ parts

$22.334

100+ parts

$18.314

1k+ parts

-

10k+ parts

-

361

$22.334

$18.314

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Lixinc

USA . 2,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,551

-

-

-

-

Overview

Elevate your projects with the PGA308AIDGST by Texas Instruments, a top-tier manufacturer known for delivering quality products. This semiconductor offers unmatched reliability and performance in various applications. Its compact design and wide operating temperature range make it an ideal choice for automotive and industrial projects. With a nominal supply voltage of 5V and dual terminal position, this product ensures seamless integration and efficient operation. Trust Texas Instruments to provide cutting-edge solutions that bring value and benefits to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable, this product allows for easy and efficient assembly onto circuit boards.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the PCB and allowing for high density integration.

Nominal Supply Voltage (Vsup): 5 V

With a nominal supply voltage of 5V, this product is compatible with common power sources, making it versatile for a wide range of applications.

Power Supplies (V): 5

Having 5 power supplies allows for efficient power management and distribution within the circuit.

No. of Terminals: 10

The 10 terminals provide ample connectivity options for interfacing with other components or subsystems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a low profile and reduced footprint, ideal for space-constrained applications and high-density PCB layouts.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments and ensures reliable performance under extreme conditions.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature allows this product to function effectively in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple terminal finishes enhances electrical conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-lasting performance.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit design and allows for versatile PCB layouts.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm contributes to a compact overall design and facilitates space-saving installations.

Width (mm): 3 mm

With a width of 3 mm, this product is suitable for compact electronic devices and applications with limited space.

Other IC type: ANALOG CIRCUIT

Being an analog circuit IC type, this product is designed for precision signal processing and accurate analog measurements, making it ideal for applications requiring high-fidelity analog performance.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures compatibility with a wide range of voltage sources and enables operation in low-power environments.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product provides a reliable soldering process during assembly, ensuring secure connections and consistent performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering and ensures robust joint formation, enhancing the product's reliability and longevity.

Length: 3 mm

Having a length of 3 mm, this product offers a compact form factor and is suitable for miniaturized electronic devices and applications with space constraints.

Temperature Grade: AUTOMOTIVE

Being automotive-grade, this product meets stringent quality standards and reliability requirements for automotive applications, ensuring durability and performance in harsh automotive environments.

No. of Channels: 2

With 2 channels, this product allows for dual signal processing or communication pathways, providing versatility and functionality for multi-channel applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure mechanical attachment and facilitates automated assembly processes, ensuring ease of installation and reliable connections.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product enables high-density mounting and interconnection in miniaturized electronic devices and space-constrained PCBs.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this product can withstand moderate moisture exposure during storage and handling, maintaining its integrity and reliability in typical operating conditions.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V offers a safety margin for voltage fluctuations and ensures compatibility with higher voltage applications, enhancing the product's versatility and reliability.

Technical Specifications

Other Function Semiconductors PGA308AIDGST attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

PGA308AIDGST Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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