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PGA305ARHHT

Texas Instruments

PGA305ARHHT by Texas Instruments

PGA305ARHHT by Texas Instruments is a 36-terminal chip carrier with a temperature range of -40 to 150°C. It operates at supply voltages from 3.3V to 30V, making it ideal for automotive applications requiring analog circuitry in compact spaces. With surface mount capability and a low profile design, it offers reliability and performance in demanding environments.

Median Price

$12.280

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,130 parts In-Stock

1+ parts

$7.695

100+ parts

$6.273

1k+ parts

$4.182

10k+ parts

-

1,130

$7.695

$6.273

$4.182

-

Mouser Electronics

USA . 331 parts In-Stock

1+ parts

$12.280

100+ parts

$8.270

1k+ parts

$7.490

10k+ parts

-

331

$12.280

$8.270

$7.490

-

DigiKey

USA . 265 parts In-Stock

1+ parts

$12.280

100+ parts

$8.267

1k+ parts

$7.610

10k+ parts

$7.494

265

$12.280

$8.267

$7.610

$7.494

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$5.700

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$5.700

-

-

-

Digiode

USA . 2,729 parts In-Stock

1+ parts

$7.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,729

$7.310

-

-

-

Vyrian

USA . 6,832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,832

-

-

-

-

SIE Connect GmbH - GreenChips

Germany . 4,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,619

-

-

-

-

Greenchips

USA . 2,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$5.586

100+ parts

-

1k+ parts

$5.363

10k+ parts

-

1,000

$5.586

-

$5.363

-

Corphita

USA . 4,735 parts In-Stock

1+ parts

$6.926

100+ parts

-

1k+ parts

-

10k+ parts

-

4,735

$6.926

-

-

-

Ampacity Inc.

Singapore . 508 parts In-Stock

1+ parts

$14.240

100+ parts

-

1k+ parts

-

10k+ parts

-

508

$14.240

-

-

-

Parana Technologies

USA . 704 parts In-Stock

1+ parts

$17.352

100+ parts

$1,611.427

1k+ parts

$15.617

10k+ parts

-

704

$17.352

$1,611.427

$15.617

-

DigiPath Technology Company

USA . 1,684 parts In-Stock

1+ parts

$19.107

100+ parts

-

1k+ parts

-

10k+ parts

-

1,684

$19.107

-

-

-

ChromeModa Solutions

Germany . 6,201 parts In-Stock

1+ parts

$19.497

100+ parts

$15.988

1k+ parts

-

10k+ parts

-

6,201

$19.497

$15.988

-

-

IDEA Electronic Components Group

UK . 686 parts In-Stock

1+ parts

$19.497

100+ parts

$18.522

1k+ parts

$17.547

10k+ parts

-

686

$19.497

$18.522

$17.547

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,465

-

-

-

-

Overview

Experience the superior quality and reliability of Texas Instruments with the PGA305ARHHT. This cutting-edge product falls under the category of Other Function Semiconductors, offering endless possibilities for various applications. With a focus on value and innovation, Texas Instruments has crafted a product that delivers exceptional performance and efficiency. Whether you're in automotive or industrial settings, this chip carrier with a very thin profile will exceed your expectations. Trust Texas Instruments to provide you with top-notch solutions that drive success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and good thermal conductivity, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape provides efficient use of space and easy alignment during assembly.

No. of Terminals: 36

Having 36 terminals allows for complex circuit connections, enabling the product to perform a wide range of functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers thermal management and space-saving benefits for high-performance applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance under demanding conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position enables easy soldering and enhances signal integrity for improved performance.

Maximum Seated Height: 1 mm

Low seated height allows for compact design and space-efficient PCB layout.

Width (mm): 6 mm

6mm width makes the product compatible with standard PCB sizes, simplifying integration.

Other IC type: ANALOG CIRCUIT

Analog circuit type offers precise signal processing capabilities, suitable for a variety of applications.

Minimum Supply Voltage (Vsup): 3.3 V

Low minimum supply voltage requirement enables energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product ensures reliable soldering without damaging components.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for robust solder joints and superior thermal performance.

Length: 6 mm

6mm length offers compatibility with standard PCB dimensions, facilitating assembly and integration.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the product can withstand harsh operating conditions in automotive environments.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and offers improved reliability in soldering.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables compact layout and high-density connections on PCBs.

Moisture Sensitivity Level (MSL): 2

MSL 2 designation indicates low moisture sensitivity, minimizing the risk of damage during storage and assembly.

Maximum Supply Voltage (Vsup): 30 V

High maximum supply voltage allows for versatile applications and compatibility with various power sources.

Technical Specifications

Other Function Semiconductors PGA305ARHHT attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

PGA305ARHHT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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