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AMC1210IRHATG4

Texas Instruments

AMC1210IRHATG4 by Texas Instruments

AMC1210IRHATG4 by Texas Instruments is a 40-terminal chip carrier with a supply voltage range of 2.7-5V, suitable for automotive applications. It operates b/w -40 to 125°C, has 4 channels, and features a moisture sensitivity level of MSL2.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 22,885 parts In-Stock

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22,885

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VNN

France . 15,709 parts In-Stock

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15,709

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Vyrian

USA . 5,463 parts In-Stock

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5,463

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Digiode

USA . 2,162 parts In-Stock

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2,162

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 230 parts In-Stock

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$1.500

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-

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230

$1.500

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Semicontronic

India . 1,343 parts In-Stock

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$2.500

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$2.438

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$2.425

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1,343

$2.500

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$2.425

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Parana Technologies

USA . 1,088 parts In-Stock

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$3.797

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$4.286

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1,088

$3.797

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$4.286

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DigiPath Technology Company

USA . 87 parts In-Stock

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$4.181

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87

$4.181

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IDEA Electronic Components Group

UK . 2,156 parts In-Stock

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$4.266

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$3.839

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$4.266

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$3.839

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ChromeModa Solutions

Germany . 1,000 parts In-Stock

1+ parts

$4.266

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$3.498

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$4.266

$3.498

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Ampacity Inc.

Singapore . 1,372 parts In-Stock

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$7.500

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1,372

$7.500

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$10.405

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$9.885

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$9.885

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40

$10.405

$9.885

$9.885

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Corohmni

South Africa . 457 parts In-Stock

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$11.665

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457

$11.665

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AZTECH Wire

Italy . 767 parts In-Stock

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$18.867

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Argo Parts USA

USA . 4,321 parts In-Stock

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Corphita

USA . 4,269 parts In-Stock

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4,269

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Microchip USA

USA . 2,674 parts In-Stock

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2,674

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iodParts Technologies Inc.

India . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 50 parts In-Stock

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Continental Prestige Electronics

USA . 38 parts In-Stock

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Overview

Discover the cutting-edge technology of the AMC1210IRHATG4 by Texas Instruments, a top-tier manufacturer known for its high-quality semiconductor products. This versatile chip carrier offers a wide range of applications in the automotive industry and beyond, boasting a very thin profile and impressive power supply capabilities. With its nickel palladium gold terminal finish and quad terminal position, this analog circuit delivers exceptional performance while ensuring reliability. Elevate your projects with the value and benefits that only Texas Instruments can provide through the AMC1210IRHATG4.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protects the internal components from external elements, making it a reliable choice.

Surface Mount:

YES - The surface mount feature allows for easier and more efficient installation on circuit boards, saving time and effort.

Package Shape:

SQUARE - The square shape makes it easier to align and mount on the PCB, ensuring a secure fit and proper functionality.

Nominal Supply Voltage (Vsup):

5 V - The 5V supply voltage ensures compatibility with a wide range of systems and applications, increasing versatility.

Power Supplies (V):

2.7/5 - The dual power supply options provide flexibility for different operating conditions, enhancing adaptability.

No. of Terminals:

40 - The high number of terminals allows for a greater degree of connectivity and integration within a circuit, improving overall performance.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - This package style offers efficient thermal management, compact design, and reduced footprint, ideal for space-constrained applications.

Maximum Operating Temperature:

125 °C - The high operating temperature range ensures stable performance in a variety of environments and conditions.

Minimum Operating Temperature:

40 °C - The wide operating temperature range allows for reliable operation in extreme cold conditions, increasing the product's reliability.

Terminal Finish:

NICKEL PALLADIUM GOLD - The gold finish on the terminals provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position:

QUAD - The quad terminal position allows for easy connection to other components, streamlining the assembly process and reducing the chances of errors.

Maximum Seated Height:

1 mm - The low profile design minimizes space requirements and allows for more compact and slim device designs, suitable for compact applications.

Width (mm):

6 mm - The compact width dimensions make it suitable for space-constrained applications, providing flexibility in design and layout.

Other IC type:

ANALOG CIRCUIT - The analog circuit type offers precise and accurate signal processing capabilities, making it suitable for a wide range of applications requiring analog functionality.

Technical Specifications

Other Function Semiconductors AMC1210IRHATG4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.7/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

AMC1210IRHATG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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