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PLM66100QDCKRQ1

Texas Instruments

PLM66100QDCKRQ1 by Texas Instruments

PLM66100QDCKRQ1 by Texas Instruments is a small outline, thin profile analog circuit IC with 6 terminals. It operates b/w -40 to 125°C and supports supply voltage range of 1.5V to 5.5V. Ideal for automotive applications due to AEC-Q100 screening level and compact design.

Median Price

$0.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.100

100+ parts

-

1k+ parts

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10k+ parts

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15

$0.100

-

-

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Vyrian

USA . 6,812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,812

-

-

-

-

Digiode

USA . 1,199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,199

-

-

-

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Bristol Electronics

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,020 parts In-Stock

1+ parts

$0.100

100+ parts

-

1k+ parts

-

10k+ parts

$0.097

4,020

$0.100

-

-

$0.097

Continental Prestige Electronics

USA . 2,989 parts In-Stock

1+ parts

$0.100

100+ parts

-

1k+ parts

-

10k+ parts

$0.098

2,989

$0.100

-

-

$0.098

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.100

100+ parts

$0.098

1k+ parts

-

10k+ parts

-

100

$0.100

$0.098

-

-

Semicontronic

India . 755 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

755

$2.500

$2.438

$2.425

-

Parana Technologies

USA . 891 parts In-Stock

1+ parts

$4.966

100+ parts

-

1k+ parts

$5.510

10k+ parts

-

891

$4.966

-

$5.510

-

DigiPath Technology Company

USA . 1,204 parts In-Stock

1+ parts

$5.468

100+ parts

-

1k+ parts

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10k+ parts

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1,204

$5.468

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ChromeModa Solutions

Germany . 4,211 parts In-Stock

1+ parts

$5.580

100+ parts

$4.576

1k+ parts

-

10k+ parts

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4,211

$5.580

$4.576

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IDEA Electronic Components Group

UK . 172 parts In-Stock

1+ parts

$5.580

100+ parts

-

1k+ parts

$5.022

10k+ parts

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172

$5.580

-

$5.022

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

1+ parts

$6.500

100+ parts

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1k+ parts

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10k+ parts

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1,143

$6.500

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One Stop Electronics

USA . 1,587 parts In-Stock

1+ parts

$7.500

100+ parts

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1k+ parts

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10k+ parts

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1,587

$7.500

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$7.706

100+ parts

$7.321

1k+ parts

$7.321

10k+ parts

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200

$7.706

$7.321

$7.321

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Corohmni

South Africa . 72 parts In-Stock

1+ parts

$14.302

100+ parts

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72

$14.302

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AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$15.965

100+ parts

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1k+ parts

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371

$15.965

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Corphita

USA . 3,031 parts In-Stock

1+ parts

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3,031

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Microchip USA

USA . 1,183 parts In-Stock

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1,183

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Overview

Unleash the power of innovation with the PLM66100QDCKRQ1 by Texas Instruments, a cutting-edge solution in the category of Other Function Semiconductors. Manufactured with top-notch quality and reliability, this product offers unmatched value and benefits to customers. From its durable plastic/epoxy package body material to its wide operating temperature range, this semiconductor is designed to excel in various applications. Trust Texas Instruments to deliver excellence with every component, and elevate your projects to new heights with the PLM66100QDCKRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount design allows for easy installation and space-saving on circuit boards, making it efficient for compact electronic devices.

Screening Level: AEC-Q100

With AEC-Q100 qualification, this product meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on circuit boards and easy integration into electronic systems.

Nominal Supply Voltage (Vsup): 3.6 V

With a stable supply voltage of 3.6V, this product ensures consistent performance and reliability in various operating conditions.

No. of Terminals: 6

The 6 terminals provide multiple connection points for different components, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves space on circuit boards and allows for efficient heat dissipation in confined spaces.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that this product can operate effectively in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position offers redundancy and increased reliability in connecting the product to external components.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm allows for a compact design and easy integration into electronic devices with space constraints.

Width (mm): 1.25 mm

The narrow width of 1.25 mm enables a compact footprint on circuit boards, ideal for miniaturized electronic devices.

Other IC type: ANALOG CIRCUIT

This product is designed as an analog circuit, providing precise and accurate signal processing for various applications.

Minimum Supply Voltage (Vsup): 1.5 V

The low minimum supply voltage of 1.5V allows for operation in low-power applications, conserving energy and extending battery life.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without damage.

Length: 2 mm

The 2 mm length of this product allows for a compact design and efficient use of space on circuit boards.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliable electrical connections.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product allows for close spacing of terminals on circuit boards, ideal for high-density designs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and operating conditions.

Technical Specifications

Other Function Semiconductors PLM66100QDCKRQ1 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

PLM66100QDCKRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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