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MPU-6050

TDK

MPU-6050 by TDK

MPU-6050 by TDK is a surface mount chip with 1 function and 24 terminals. It operates at temperatures ranging from -40 to 85°C and has a max seated height of 0.95mm. This industrial-grade CMOS technology is commonly used in analog circuits.

Median Price

$9.317

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Element14

Singapore . 15 parts In-Stock

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$9.317

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$6.350

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Farnell

UK . 15 parts In-Stock

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$9.811

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$5.773

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$5.656

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Avnet

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Verical

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Nova Conductors

Japan . 150 parts In-Stock

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Component Electronics Inc.

Canada . 1,621 parts In-Stock

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Rotakorn

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Semtec, LLC

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Vyrian

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Cyclops Electronics Ltd

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Demsay Elektronik

Türkiye . 250 parts In-Stock

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$750.000

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Atlantic Semiconductor

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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Aztec Data Supply Inc.

USA . 2,273 parts In-Stock

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$1.979

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$1.979

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Modulus Dynamics

Lithuania . 5,706 parts In-Stock

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$4.478

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Corohmni

South Africa . 269 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$4.612

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$4.382

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Kepictronics

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Perfect Parts

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RC Electronics

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Technoshack Inc. (Excess)

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iodParts Technologies Inc.

India . 5,397 parts In-Stock

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Continental Prestige Electronics

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Robosynatics

Brazil . 1,783 parts In-Stock

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Lucentia Tech

USA . 1,783 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Argo Parts USA

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Netroflash

USA . 50 parts In-Stock

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$6.894

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Cyclops Electronics Ltd (Excess)

UK . 23 parts In-Stock

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Overview

Discover the MPU-6050 by TDK, a high-quality semiconductor device that stands out in the market. With TDK's solid reputation for excellence, this product is guaranteed to exceed your expectations. The MPU-6050 opens up a world of possibilities with its wide range of applications. Whether you're in consumer electronics, robotics, or virtual reality, this versatile chip will enhance your projects. Experience the value and benefits it brings, from its reliable performance to its compact design. Trust TDK and choose the MPU-6050 for all your semiconductor needs.

Feature Benefit Bullets

Surface Mount: YES

This product is designed for easy and convenient mounting on circuit boards, making it highly compatible for various applications.

No. of Functions: 1

With a single function, this product offers simplicity and focused performance, ideal for specific tasks.

Package Shape: SQUARE

The square package shape enhances space utilization on the circuit board, allowing for efficient design and layout.

Nominal Supply Voltage (Vsup): 2.5 V

The 2.5V supply voltage provides a stable and suitable power source, ensuring reliable and consistent performance.

Power Supplies (V): 1.8,2.5/3.3

This product supports multiple voltage options, enabling flexibility in different operating environments.

No. of Terminals: 24

With 24 terminals, this product offers a wide range of connectivity options, enhancing compatibility and versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, combined with a heat sink/slug and a very thin profile, ensures efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this product to withstand demanding conditions while maintaining optimal performance.

Minimum Operating Temperature: -40 °C

This product can operate reliably in extremely low temperatures, making it suitable for various environments and climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position offers improved stability and mechanical strength, enhancing the product's overall durability.

Maximum Seated Height: 0.95 mm

With a low maximum seated height, this product occupies minimal space on the circuit board, facilitating compact and slim designs.

Width (mm): 4 mm

The 4mm width of this product allows for efficient use of space, enabling compact and streamlined circuit board layouts.

Other IC type: ANALOG CIRCUIT

This product is an analog circuit integrated circuit, perfect for applications requiring precision analog processing.

Minimum Supply Voltage (Vsup): 2.375 V

The minimum supply voltage of 2.375V ensures compatibility with various power sources, allowing for flexibility in different systems.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand high-temperature reflow processes with a maximum time of 30 seconds, providing ease of manufacturing and assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can handle high-temperature soldering processes, enhancing reliability during manufacturing.

Length: 4 mm

The 4mm length of this product enables space-efficient circuit board designs while maintaining excellent performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can operate reliably in harsh conditions, making it a durable and robust choice.

Technology: CMOS

This product utilizes Complementary Metal-Oxide-Semiconductor (CMOS) technology, ensuring low power consumption and high speed.

Terminal Form: NO LEAD

The terminal form of this product is lead-free, adhering to environmental regulations and reducing potential health hazards.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product offers fine-pitch connections, suitable for applications with space constraints.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level 3 ensures proper handling and storage, preventing damage caused by moisture during assembly and operation.

Maximum Supply Voltage (Vsup): 3.46 V

With a high maximum supply voltage of 3.46V, this product can accommodate various power sources, providing flexibility in different applications.

Technical Specifications

Other Function Semiconductors MPU-6050 attributes and parameters. Explore more Other Function Semiconductors devices from TDK

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.95 mm

Sub-Category:

Other Analog ICs

Maximum Supply Voltage (Vsup):

3.46 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

MPU-6050 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

TDK

TDK was founded as a venture enterprise in 1935 for the purpose of industrializing a magnetic material called ferrite, which was invented at the Tokyo Institute of Technology. TDK's corporate motto is "Contribute to culture and industry through creativity," a message that embodies the company's founding spirit. Guided by this spirit, in the ensuing year TDK has sought to refine its materials and process technologies, as it develops new products that satisfy market needs. Concurrently, TDK advances globalization and diversification of its business operation while actively pursuing M&As, collaboration with external partners and other initiatives. As a result, TDK today is engaged in four main businesses: Passive Components, Sensor Application Products, Magnetic Application Products, and Energy Application Products. Looking ahead, TDK would like to remain a dynamic company that continues to deliver even higher value to all stakeholders, including shareholders, customers, suppliers, employees and local communities, by bringing together the entire Group's strengths while taking full advantage of the strengths of each Group company, and constantly drawing on innovative thinking and a willingness to tackle new challenges.

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