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NCV33039DR2G

Onsemi

NCV33039DR2G by Onsemi

NCV33039DR2G by Onsemi is an 8-terminal IC with a supply voltage range of 5.5-8.25V, suitable for automotive applications. It operates b/w -40 to 125°C, with a max seated height of 1.75mm and peak reflow temperature of 260°C. This small outline package features gull wing terminals and is designed for analog circuit functions in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,585 parts In-Stock

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Digiode

USA . 1,808 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 646 parts In-Stock

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$2.500

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646

$2.500

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Semicontronic

India . 1,434 parts In-Stock

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$6.500

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$6.338

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$6.305

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$6.500

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$6.305

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Aztec Data Supply Inc.

USA . 3,340 parts In-Stock

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$8.210

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AZTECH Wire

Italy . 607 parts In-Stock

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$13.315

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Advanced Electronics

New Zealand . 95 parts In-Stock

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$19.109

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$18.153

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$18.153

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$19.109

$18.153

$18.153

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Problanco Electronics

Mexico . 6,847 parts In-Stock

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SupplyDigital Components

Austria . 5,818 parts In-Stock

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TANS Electronics

Latvia . 5,563 parts In-Stock

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Corphita

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Argo Parts USA

USA . 1,681 parts In-Stock

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Kulean Microsystems

USA . 1,485 parts In-Stock

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UHIMA Technologies

Türkiye . 935 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

USA . 420 parts In-Stock

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Corohmni

South Africa . 349 parts In-Stock

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Vigor

Singapore . 273 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Kepictronics

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Overview

Experience top-notch performance and reliability with the NCV33039DR2G by Onsemi. As a trusted manufacturer in the semiconductor industry, Onsemi delivers cutting-edge solutions for various applications. This small outline package offers customers the advantage of a wide supply voltage range, making it ideal for automotive and other analog circuit applications. With a maximum operating temperature of 125°C and excellent thermal management, this product ensures optimal performance even in challenging environments. Trust Onsemi to provide high-quality products that meet your needs effectively and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, making it suitable for smaller electronic devices or crowded PCB layouts.

Nominal Supply Voltage (Vsup): 6.25 V

The 6.25V nominal supply voltage provides stable and reliable performance in electronic circuits requiring this specific voltage level.

Power Supplies (V): 6.25

The 6.25V power supply capability ensures compatibility with systems that require this voltage input.

No. of Terminals: 8

With 8 terminals available, this product offers flexibility in connectivity and integration within a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the product's reliability and stability under various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in extreme cold environments.

Terminal Finish: TIN

The terminal finish of tin provides good conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for more secure connections and better thermal management in the circuit.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm enables a compact overall design for space-constrained applications.

Width (mm): 3.9 mm

The narrow width of 3.9mm makes the product suitable for installations in tight spaces or on densely populated circuit boards.

Other IC type: ANALOG CIRCUIT

This product's analog circuit type ensures accurate signal processing and compatibility with analog systems.

Minimum Supply Voltage (Vsup): 5.5 V

The 5.5V minimum supply voltage requirement allows for operation in systems with lower voltage sources.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C guarantees proper solder reflow and strong bonds for secure connections.

Length: 4.9 mm

The compact length of 4.9mm contributes to the product's overall small footprint and suitability for space-critical applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates the product's ability to withstand harsh environmental conditions typically found in automotive applications.

Maximum Supply Current (Isup): 5 mA

With a maximum supply current of 5mA, this product is suitable for low-power applications that require minimal energy consumption.

Terminal Form: GULL WING

The gull-wing terminal form provides reliable connections and facilitates ease of soldering during assembly.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections on the PCB, ensuring proper signal transmission.

Maximum Supply Voltage (Vsup): 8.25 V

The high maximum supply voltage capability of 8.25V enables compatibility with systems requiring higher voltage inputs.

Technical Specifications

Other Function Semiconductors NCV33039DR2G attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.25

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

8.25 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

6.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCV33039DR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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