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PCI1250GFN

Texas Instruments

PCI1250GFN by Texas Instruments

PCI1250GFN by Texas Instruments is a 32-bit bus controller with 256 terminals, operating at up to 33.33 MHz. It is a PCMCIA peripheral IC compatible with PCI buses, featuring a temperature range of 0-70°C. The package style is grid array, suitable for various commercial applications.

Median Price

$15.325

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$12.260

1k+ parts

$10.970

10k+ parts

$10.330

480

-

$12.260

$10.970

$10.330

DigiKey

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$16.140

1k+ parts

-

10k+ parts

-

480

-

$16.140

-

-

Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$15.325

1k+ parts

$13.713

10k+ parts

$12.912

480

-

$15.325

$13.713

$12.912

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,454 parts In-Stock

1+ parts

$12.939

100+ parts

-

1k+ parts

-

10k+ parts

-

2,454

$12.939

-

-

-

Vyrian

USA . 6,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,532

-

-

-

-

DigiKey Marketplace

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

480

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,002 parts In-Stock

1+ parts

$12.258

100+ parts

-

1k+ parts

-

10k+ parts

-

4,002

$12.258

-

-

-

Component Stockers USA

USA . 964 parts In-Stock

1+ parts

$13.800

100+ parts

$12.970

1k+ parts

-

10k+ parts

-

964

$13.800

$12.970

-

-

Parana Technologies

USA . 1,517 parts In-Stock

1+ parts

$33.962

100+ parts

-

1k+ parts

$137.875

10k+ parts

-

1,517

$33.962

-

$137.875

-

DigiPath Technology Company

USA . 1,579 parts In-Stock

1+ parts

$37.396

100+ parts

$34.404

1k+ parts

-

10k+ parts

-

1,579

$37.396

$34.404

-

-

ChromeModa Solutions

Germany . 6,521 parts In-Stock

1+ parts

$38.159

100+ parts

$31.290

1k+ parts

-

10k+ parts

-

6,521

$38.159

$31.290

-

-

IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$38.159

100+ parts

$36.251

1k+ parts

$34.343

10k+ parts

-

1,050

$38.159

$36.251

$34.343

-

Corohmni

South Africa . 289 parts In-Stock

1+ parts

$57.805

100+ parts

-

1k+ parts

-

10k+ parts

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289

$57.805

-

-

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A-Z Elektronik GmbH

Germany . 5,096 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,096

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-

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Kepictronics

USA . 1,320 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,320

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Overview

Unlock the power of seamless connectivity with the Texas Instruments PCI1250GFN Bus Controller. Known for its top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in every product. The PCI1250GFN is perfect for a wide range of applications, offering unparalleled value and benefits to customers. Say goodbye to connectivity issues and hello to smooth operations with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus controller, ensuring reliability and longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in manufacturing processes.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power requirements and compatibility with various systems.

Address Bus Width: 32

A wider address bus width allows for more data transfer capabilities and support for larger memory capacities.

Package Shape: SQUARE

The square package shape helps in efficient placement and alignment on circuit boards, optimizing space utilization.

No. of Terminals: 256

The high number of terminals enable connectivity with multiple devices and peripherals, enhancing the versatility of the bus controller.

Package Style (Meter): GRID ARRAY

The grid array package style provides secure attachment to the circuit board and ensures reliable electrical connections.

Minimum Supply Voltage: 3 V

The lower minimum supply voltage helps in reducing power consumption and enables operation in energy-efficient systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures stable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation in cold environments without compromising performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections to external devices, enhancing the usability of the bus controller.

Maximum Seated Height: 2.32 mm

The low maximum seated height helps in achieving compact designs and reducing overall system size.

Width: 27 mm

The compact width dimension allows for integration into space-constrained systems without compromising functionality.

External Data Bus Width: 32

A wide external data bus width enables high-speed data transfer and efficient communication between the bus controller and connected devices.

Maximum Clock Frequency: 33.33 MHz

The high maximum clock frequency supports fast data processing and real-time operation, making the bus controller suitable for demanding applications.

Length: 27 mm

The compact length dimension contributes to space-saving designs and allows for flexible placement within the system.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating environments, making the bus controller suitable for a wide range of applications.

Peripheral IC Type: BUS CONTROLLER, PCMCIA

Specifically designed as a bus controller for PCMCIA cards, allowing seamless integration and communication with compatible devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of system architectures, making the bus controller energy-efficient and versatile.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable electrical contact, ensuring stable performance in various operating conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources and support for a wide range of devices and systems.

Bus Compatibility: PCI

Designed for PCI bus compatibility, enabling seamless integration into PCI-based systems and expansion slots.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for dense packing of terminals, enabling efficient use of space on the circuit board and simplifying assembly processes.

Technical Specifications

Bus Controllers PCI1250GFN attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.32 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

PCI1250GFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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