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ONET4201LDRGETG4

Texas Instruments

ONET4201LDRGETG4 by Texas Instruments

ONET4201LDRGETG4 by Texas Instruments is a 24-terminal interface IC with a supply voltage range of 3-3.6V, operating temperature from -40 to 85°C, and terminal finish in nickel palladium gold. It is designed for industrial applications requiring a compact chip carrier package with surface mount capability and very thin profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,136 parts In-Stock

1+ parts

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5,136

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Digiode

USA . 4,517 parts In-Stock

1+ parts

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4,517

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 71 parts In-Stock

1+ parts

$1.956

100+ parts

$181.665

1k+ parts

$1.761

10k+ parts

-

71

$1.956

$181.665

$1.761

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DigiPath Technology Company

USA . 947 parts In-Stock

1+ parts

$2.154

100+ parts

-

1k+ parts

-

10k+ parts

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947

$2.154

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ChromeModa Solutions

Germany . 4,372 parts In-Stock

1+ parts

$2.198

100+ parts

$1.802

1k+ parts

-

10k+ parts

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4,372

$2.198

$1.802

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IDEA Electronic Components Group

UK . 1,100 parts In-Stock

1+ parts

$2.198

100+ parts

-

1k+ parts

$1.978

10k+ parts

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1,100

$2.198

-

$1.978

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AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$11.330

100+ parts

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587

$11.330

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One Stop Electronics

USA . 253 parts In-Stock

1+ parts

$44.500

100+ parts

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253

$44.500

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Component Stockers USA

USA . 722 parts In-Stock

1+ parts

$99.990

100+ parts

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722

$99.990

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Corphita

USA . 599 parts In-Stock

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599

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Overview

Unlock seamless connectivity and efficiency with the ONET4201LDRGETG4 by Texas Instruments. Crafted with precision and quality, this interface IC offers unparalleled performance in a variety of applications. From automotive to industrial settings, this product guarantees reliability and adaptability. With Texas Instruments leading the charge in innovation and technology, you can trust that this product is designed to exceed expectations. Experience the value of superior engineering and maximize your productivity with the ONET4201LDRGETG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability of 3.6V provides flexibility in power input, making it compatible with a wide range of systems.

Package Shape: SQUARE

The square package shape helps optimize PCB layout and space utilization, making it easier to integrate into compact designs.

Power Supplies (V): 3.3

The 3.3V power supply ensures reliable and consistent performance, suitable for various electronic applications.

No. of Terminals: 24

With a higher number of terminals, the product offers more connectivity options and flexibility for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provide efficient heat management and space-saving benefits in electronic designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources while maintaining efficient power usage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C guarantees reliable operation in extreme cold conditions, making it suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring stable connections and long-term reliability.

Terminal Position: QUAD

The quad terminal position provides secure and stable connections, reducing the risk of signal loss or interference in critical applications.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for compact and low-profile design integration, making it suitable for space-constrained applications.

Width: 4 mm

The 4mm width offers a compact form factor, enabling easy placement and integration into various electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient and reliable soldering during assembly processes, reducing the risk of component damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables high-quality soldering connections, ensuring long-term reliability in demanding operating conditions.

Length: 4 mm

The 4mm length offers a balanced form factor, allowing for easy integration and placement within electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications with stringent operating requirements.

Terminal Form: NO LEAD

The no lead terminal form complies with environmental regulations and standards, ensuring eco-friendly design and manufacturing practices.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage provides stable and consistent power input, ensuring reliable operation in various electronic systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise and compact layout designs, enabling high-density connections and efficient PCB integration.

Moisture Sensitivity Level (MSL): 2

The MSL level 2 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain component integrity and reliability.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type offers versatile connectivity options and signal processing capabilities, making it suitable for various communication and interface applications.

Technical Specifications

Other Function Interface ICs ONET4201LDRGETG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ONET4201LDRGETG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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