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ONET4201LDRGERG4

Texas Instruments

ONET4201LDRGERG4 by Texas Instruments

ONET4201LDRGERG4 by Texas Instruments is a 24-terminal interface IC with a max supply voltage of 3.6V and operating temperature range from -40 to 85°C. It features a square package shape, suitable for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$2.001

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.690

10k+ parts

$1.590

1,500

-

$1.890

$1.690

$1.590

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.112

10k+ parts

$1.988

1,500

-

-

$2.112

$1.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 138 parts In-Stock

1+ parts

$1.682

100+ parts

-

1k+ parts

-

10k+ parts

-

138

$1.682

-

-

-

Vyrian

USA . 2,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,294

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,184 parts In-Stock

1+ parts

$1.593

100+ parts

-

1k+ parts

-

10k+ parts

-

3,184

$1.593

-

-

-

Parana Technologies

USA . 1,118 parts In-Stock

1+ parts

$13.233

100+ parts

-

1k+ parts

$13.738

10k+ parts

-

1,118

$13.233

-

$13.738

-

DigiPath Technology Company

USA . 1,341 parts In-Stock

1+ parts

$14.571

100+ parts

$13.405

1k+ parts

-

10k+ parts

-

1,341

$14.571

$13.405

-

-

ChromeModa Solutions

Germany . 4,584 parts In-Stock

1+ parts

$14.868

100+ parts

$12.192

1k+ parts

-

10k+ parts

-

4,584

$14.868

$12.192

-

-

IDEA Electronic Components Group

UK . 2,236 parts In-Stock

1+ parts

$14.868

100+ parts

$14.125

1k+ parts

$13.381

10k+ parts

-

2,236

$14.868

$14.125

$13.381

-

A-Z Elektronik GmbH

Germany . 6,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,693

-

-

-

-

Microchip USA

USA . 3,320 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,320

-

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Perfect Parts

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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874

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-

-

-

Kepictronics

USA . 35 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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35

-

-

-

-

Overview

Unlock the power of seamless connectivity with the ONET4201LDRGERG4 by Texas Instruments. Crafted with precision and expertise, this innovative interface IC promises reliability and durability like no other. Whether used in industrial applications or consumer electronics, this product offers unparalleled performance and efficiency. Say goodbye to connectivity issues and hello to a world of endless possibilities with the ONET4201LDRGERG4. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage range, suitable for a variety of applications.

Package Shape: SQUARE

Square package shape ensures stability and ease of handling during assembly.

Power Supplies (V): 3.3

Provides a stable power supply at 3.3V for reliable performance.

No. of Terminals: 24

Ample terminals for connectivity and functionality in complex circuits.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles cater to different design requirements and thermal considerations.

Minimum Supply Voltage: 3 V

Supports a minimum supply voltage of 3V, ensuring compatibility with various systems.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions for versatility in environmental settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures good conductivity and corrosion resistance for long-term performance.

Terminal Position: QUAD

Quad terminal position facilitates easy connection and soldering on the PCB.

Maximum Seated Height: 1 mm

Low seated height allows for compact design and efficient use of space.

Width: 4 mm

Narrow width enables placement in tight spaces on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering process for 30 seconds without damage.

Peak Reflow Temperature °C: 260

Can endure high reflow temperatures during assembly for proper soldering.

Length: 4 mm

Compact length for space-saving and efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh conditions.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations.

Maximum Supply Current: 55 mA

Supports a maximum supply current of 55mA for various power requirements.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm for high-density mounting and connectivity.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates moderate sensitivity, suitable for standard manufacturing processes.

Interface IC Type: INTERFACE CIRCUIT

Specialized as an interface circuit IC for efficient communication between different components.

Technical Specifications

Other Function Interface ICs ONET4201LDRGERG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Display Drivers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ONET4201LDRGERG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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