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ONET4291VARGPTG4

Texas Instruments

ONET4291VARGPTG4 by Texas Instruments

ONET4291VARGPTG4 by Texas Instruments is a 20-terminal interface IC with a supply voltage range of 2.9V to 3.6V, suitable for industrial applications. It features a square package shape, nickel palladium gold terminal finish, and operates in temperatures ranging from -40°C to 85°C. Ideal for surface mount assembly with a compact size of 4mm x 4mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,715 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,715

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Digiode

USA . 3,547 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,547

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 266 parts In-Stock

1+ parts

$4.187

100+ parts

-

1k+ parts

$4.628

10k+ parts

-

266

$4.187

-

$4.628

-

ChromeModa Solutions

Germany . 2,130 parts In-Stock

1+ parts

$4.705

100+ parts

$3.858

1k+ parts

-

10k+ parts

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2,130

$4.705

$3.858

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IDEA Electronic Components Group

UK . 921 parts In-Stock

1+ parts

$4.705

100+ parts

-

1k+ parts

$4.234

10k+ parts

-

921

$4.705

-

$4.234

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AZTECH Wire

Italy . 443 parts In-Stock

1+ parts

$9.277

100+ parts

-

1k+ parts

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10k+ parts

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443

$9.277

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One Stop Electronics

USA . 261 parts In-Stock

1+ parts

$33.500

100+ parts

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10k+ parts

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261

$33.500

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Corphita

USA . 2,432 parts In-Stock

1+ parts

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2,432

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DigiPath Technology Company

USA . 1,665 parts In-Stock

1+ parts

-

100+ parts

$4.242

1k+ parts

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10k+ parts

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1,665

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$4.242

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Perfect Parts

USA . 874 parts In-Stock

1+ parts

-

100+ parts

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874

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Overview

Enhance your electronic projects with the ONET4291VARGPTG4 by Texas Instruments, a top-quality Other Function Interface IC. Designed with precision and reliability in mind, this IC offers seamless integration and superior performance. Whether you're working on IoT devices, automation systems, or communication networks, this product provides the value and efficiency you need to succeed. Trust Texas Instruments for innovative solutions that elevate your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the interface IC.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly of the interface IC onto a PCB.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this interface IC can handle a wide range of power supply levels.

Package Shape: SQUARE

The square package shape provides a compact footprint, saving space on the PCB.

Power Supplies (V): 3.3

Operates on a nominal supply voltage of 3.3V making it compatible with standard power sources.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interfaces, increasing functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer flexibility in terms of heat dissipation and space constraints.

Minimum Supply Voltage: 2.9 V

The low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Withstands low temperatures ensuring reliable performance in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

The quad terminal position allows for secure and stable mounting on the PCB.

Maximum Seated Height: 1 mm

The low seated height makes it suitable for compact designs and tight spaces.

Width: 4 mm

The narrow width contributes to space-saving on the PCB and efficient layout designs.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified period, ensuring proper soldering and assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures secure solder joints during assembly.

Length: 4 mm

The short length facilitates compact PCB layouts and efficient use of space.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, making it suitable for harsh environments.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and complies with environmental regulations.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3V, ensuring compatibility with standard power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this interface IC can withstand moderate moisture levels during storage and assembly.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuits, ensuring optimal performance and functionality for communication applications.

Technical Specifications

Other Function Interface ICs ONET4291VARGPTG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.9 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ONET4291VARGPTG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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