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JM38510/37203BRA

Texas Instruments

JM38510/37203BRA by Texas Instruments

JM38510/37203BRA by Texas Instruments is an 8-bit bus driver with a 5V supply voltage, 29ns propagation delay, and 12A max output current. Ideal for military applications due to MIL-M-38510 Class B screening level and TTL technology. Package style is in-line with dual terminals and true output polarity.

Median Price

$39.741

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Avnet

USA . 4 parts In-Stock

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$39.741

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Freelance Electronics

USA . 96 parts In-Stock

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$14.530

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$15.256

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$14.385

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Bristol Electronics

USA . 151 parts In-Stock

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$19.200

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$16.984

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$16.247

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Vyrian

USA . 7,986 parts In-Stock

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Digiode

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Electronic Expediters

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Microfarads

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North Shore Components

USA . 76 parts In-Stock

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Mil-Aero Solutions, Inc.

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R&J Components

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Inland Empire Components Inc.

USA . 20 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Resion

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Manoshevitz Elec. Sales

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MISTER SPROCKETS

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Legend Electronics Inc.

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Corel Iberica Componentes, S.L.

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Electronics Depot

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Elcom Components

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Andel Nordic

Denmark . 310 parts In-Stock

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$3.870

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$3.715

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$3.715

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$3.715

AZTECH Wire

Italy . 194 parts In-Stock

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$10.319

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Parana Technologies

USA . 1,152 parts In-Stock

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$28.624

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$49.697

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DigiPath Technology Company

USA . 1,041 parts In-Stock

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$31.519

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$28.997

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ChromeModa Solutions

Germany . 5,724 parts In-Stock

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$32.162

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$26.373

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IDEA Electronic Components Group

UK . 235 parts In-Stock

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$30.554

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One Stop Electronics

USA . 959 parts In-Stock

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Microchip USA

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Corphita

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Perfect Parts

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Assy Fe

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Overview

Unlock the power of reliable communication with the Texas Instruments JM38510/37203BRA bus driver and transceiver. Crafted with precision and quality materials, this military-grade component offers seamless integration into a variety of applications. Experience the superior performance and durability that Texas Instruments is known for, providing customers with peace of mind and exceptional value. Enhance your projects with the trusted technology of the JM38510/37203BRA and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and resistance to environmental factors, making this product suitable for rugged applications.

Screening Level: MIL-M-38510 Class B

This high screening level ensures reliability and adherence to strict military standards, making it a dependable choice for critical applications.

Propagation Delay (tpd): 29 ns

The low propagation delay of 29 ns ensures fast signal transmission, making this bus driver efficient for time-critical applications.

Minimum Operating Temperature: -55 °C

The wide temperature range of -55 to 125°C allows this bus driver to operate in harsh environments, providing reliability in extreme conditions.

Technology: TTL

The TTL technology offers high-speed performance and compatibility with a wide range of systems, making this bus driver a versatile choice for various applications.

Technical Specifications

Bus Driver & Transceivers JM38510/37203BRA attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay (tpd):

29 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/37203BRA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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