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JM38510/37202BEA

Texas Instruments

JM38510/37202BEA by Texas Instruments

JM38510/37202BEA by Texas Instruments is a 4-bit latches & flip-flops with 24ns propagation delay, suitable for military applications. It operates at 5V with 50pF load capacitance and has a max frequency of 40MHz. The package style is in-line, MIL-M-38510 Class B screened, and features TTL technology.

Median Price

$36.236

Lifecycle Status

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18

In-Stock Inventory

1k+

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Rochester

USA . 234 parts In-Stock

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$32.210

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$28.820

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$27.130

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$27.130

DigiKey

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Verical

USA . 226 parts In-Stock

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$40.263

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$36.025

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$33.913

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$33.913

Distributors (In-Stock)

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Freelance Electronics

USA . 177 parts In-Stock

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$1.739

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$1.826

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$1.722

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177

$1.739

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Ace Electronics

USA . 11 parts In-Stock

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$15.000

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Digiode

USA . 4,899 parts In-Stock

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$29.564

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Vyrian

USA . 7,350 parts In-Stock

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Resion

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Electronic Expediters

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Mil-Aero Solutions, Inc.

USA . 64 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

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J & M Industries LLC

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MISTER SPROCKETS

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First Choice Components Inc.

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Prism Electronics

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Parana Technologies

USA . 2,059 parts In-Stock

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$9.918

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$10.487

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$9.918

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DigiPath Technology Company

USA . 1,600 parts In-Stock

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$10.921

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ChromeModa Solutions

Germany . 1,585 parts In-Stock

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$11.144

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$9.138

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IDEA Electronic Components Group

UK . 1,361 parts In-Stock

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$11.144

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$10.587

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$10.030

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Ampacity Inc.

Singapore . 132 parts In-Stock

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Corphita

USA . 4,422 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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A-Plus Industry Inc.

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Overview

Elevate your electronic designs with the JM38510/37202BEA from Texas Instruments, a cutting-edge latches & flip-flops component that delivers unparalleled quality and reliability. Manufactured to MIL-M-38510 Class B standards, this product is ideal for a wide range of applications, offering a nominal supply voltage of 5V and a maximum frequency of 40MHz. With fast propagation delay and a maximum power supply current of 14mA, this component ensures optimal performance in military-grade environments. Trust Texas Instruments for innovative solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 24 ns

The low propagation delay ensures fast signal processing, making this product suitable for applications where speed is crucial.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various circuit designs, optimizing space usage and layout efficiency.

Nominal Supply Voltage: 5V

The 5V nominal supply voltage is commonly used in many electronic systems, making this latch & flip-flop compatible with a wide range of applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures reliable and precise signal detection, reducing the risk of miscommunication or errors in data processing.

Technology: TTL

The TTL technology used in this product offers high noise immunity and reliable performance, making it a stable and dependable choice for digital circuitry.

Technical Specifications

Latches & Flip-Flops JM38510/37202BEA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

40000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

14 mA

Propagation Delay At Nominal Supply:

24 ns

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Minimum fmax:

40 MHz

Trade Compliance

JM38510/37202BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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