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JM38510/01702BEA

Texas Instruments

JM38510/01702BEA by Texas Instruments

JM38510/01702BEA by Texas Instruments is a 4-bit latch with MIL-M-38510 Class B screening. It operates at 5V, has a propagation delay of 35ns, and supports a max frequency of 25MHz. Ideal for military applications requiring fast positive edge triggering in harsh environments.

Median Price

$4.900

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 264 parts In-Stock

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$2.899

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$3.044

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$2.870

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TEDSS.com

USA . 20 parts In-Stock

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$4.900

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Ace Electronics

USA . 4 parts In-Stock

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$5.000

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Vyrian

USA . 8,587 parts In-Stock

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Anansix

USA . 2,814 parts In-Stock

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Mil-Aero Solutions, Inc.

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Electronic Expediters

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Resion

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Digiode

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R&J Components

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Bristol Electronics

USA . 55 parts In-Stock

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Atlantic Semiconductor

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Microfarads

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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Dan-Mar Components

USA . 19 parts In-Stock

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Electronics Depot

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Odi Ramu Company

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MRC Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 817 parts In-Stock

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$11.936

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Parana Technologies

USA . 328 parts In-Stock

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$19.538

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$1,814.415

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$17.584

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$19.538

$1,814.415

$17.584

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DigiPath Technology Company

USA . 1,051 parts In-Stock

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$21.514

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IDEA Electronic Components Group

UK . 1,987 parts In-Stock

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$21.953

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$20.855

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$19.758

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ChromeModa Solutions

Germany . 1,255 parts In-Stock

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$21.953

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$18.001

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One Stop Electronics

USA . 1,024 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Overview

Unlock the power of reliable performance with the JM38510/01702BEA by Texas Instruments. Crafted with precision and quality, this latches & flip-flops device offers seamless functionality in a variety of applications. From military-grade screening to a wide operating temperature range, this product delivers value and efficiency to customers seeking top-notch electronic components. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability in harsh environments.

Screening Level: MIL-M-38510 Class B

Meets stringent military standards for quality and reliability, making it suitable for critical applications.

No. of Bits: 4

Provides sufficient capacity for storing and processing data, making it versatile for various functions.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, ensuring easy integration into existing systems.

Propagation Delay (tpd): 35 ns

Offers fast response times for switching operations, enhancing overall performance.

Trigger Type: POSITIVE EDGE

Allows for precise control and timing of signal transitions, enhancing reliability in synchronous applications.

Technology: TTL

Utilizes well-established TTL technology for reliable and consistent operation, ensuring compatibility with legacy systems.

Technical Specifications

Latches & Flip-Flops JM38510/01702BEA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

JM38510/01702BEA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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