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JM38510/05151BCA

Texas Instruments

JM38510/05151BCA by Texas Instruments

JM38510/05151BCA by Texas Instruments is a MILITARY-grade latch with 2 functions, 300 ns propagation delay at 5V. It has a ceramic package and operates b/w -55 to 125 °C. Ideal for applications requiring positive edge trigger and complementary output polarity.

Median Price

$70.580

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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Arrow

USA . 32 parts In-Stock

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Digiode

USA . 686 parts In-Stock

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TME

Poland . 32 parts In-Stock

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Vyrian

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Anansix

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Nova Conductors

Japan . 600 parts In-Stock

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Bristol Electronics

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Manoshevitz Elec. Sales

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Mil-Aero Solutions, Inc.

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North Shore Components

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Prism Electronics

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Corel Iberica Componentes, S.L.

Spain . 11 parts In-Stock

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Velocity Electronics

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Odi Ramu Company

Canada . 8 parts In-Stock

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Sunrise Surplus Inc.

USA . 7 parts In-Stock

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Lakeland Logistics Inc

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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LWI Electronics Inc

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Microfarads

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Parana Technologies

USA . 1,490 parts In-Stock

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$20.640

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$20.745

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Corohmni

South Africa . 47 parts In-Stock

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$21.457

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DigiPath Technology Company

USA . 1,193 parts In-Stock

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$22.727

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ChromeModa Solutions

Germany . 2,061 parts In-Stock

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$23.191

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$19.017

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Corphita

USA . 2,118 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Microchip USA

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Aranea Global

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A-Z Elektronik GmbH

Germany . 317 parts In-Stock

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Perfect Parts

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Assy Fe

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Overview

Unlock the power of reliable and high-quality latches & flip-flops with the Texas Instruments JM38510/05151BCA. Manufactured by industry leader Texas Instruments, this product boasts superior performance and durability. Ideal for military-grade applications, this versatile component offers a wide range of benefits, including fast propagation delay, low power consumption, and a wide operating temperature range. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Experience the difference with the JM38510/05151BCA today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, ensuring the latch or flip-flop remains operational in various environments.

Propagation Delay At Nominal Supply: 300 ns

Fast propagation delay ensures quick response time, making this product suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage makes integration into existing circuits easy and provides compatibility with common power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance even in harsh or demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop efficient and reliable.

Technical Specifications

Latches & Flip-Flops JM38510/05151BCA attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6.8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

.6 mA

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

12 MHz

Trade Compliance

JM38510/05151BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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