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JM38510/37006BCA

Texas Instruments

JM38510/37006BCA by Texas Instruments

JM38510/37006BCA by Texas Instruments is a MILITARY-grade Logic Gates IC with 6 functions, 17ns Propagation Delay at 5V. It has a package style of IN-LINE and operates b/w -55 to 125 °C. Ideal for applications requiring high-speed signal processing in harsh environments.

Median Price

$23.738

Lifecycle Status

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37

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1k+

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Rochester

USA . 372 parts In-Stock

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$21.100

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$18.880

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$17.770

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DigiKey

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Verical

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Avnet

USA . 22 parts In-Stock

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Freelance Electronics

USA . 242 parts In-Stock

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Ace Electronics

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NAC Semi

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Digiode

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Vyrian

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Electronic Expediters

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Classic Components Corporation

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DigiKey Marketplace

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Mil-Aero Solutions, Inc.

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Connector Distribution Corp

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Right Parts Inc.

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Microfarads

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ACDS - Activité Composants Distribution Service

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Sunrise Surplus Inc.

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Resion

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Odintec Ltd.

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North Shore Components

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Eagle Technology Solutions

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Inland Empire Components Inc.

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PC Components Company LLC

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Legend Electronics Inc.

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J & M Industries LLC

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Prism Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Manoshevitz Elec. Sales

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Elcom Components

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Odi Ramu Company

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First Choice Components Inc.

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Parana Technologies

USA . 1,667 parts In-Stock

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$8.835

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$9.521

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DigiPath Technology Company

USA . 1,427 parts In-Stock

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ChromeModa Solutions

Germany . 4,566 parts In-Stock

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IDEA Electronic Components Group

UK . 1,143 parts In-Stock

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Corphita

USA . 4,781 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Unlock the power of reliable performance with Texas Instruments' JM38510/37006BCA Logic Gates. Designed with precision and durability in mind, this product offers unmatched quality and efficiency for a wide range of applications. From military-grade screening to 3-STATE output characteristics, customers can trust in the value and benefits that this product provides. Experience seamless operation and enhanced functionality with Texas Instruments' Logic Gates, setting new standards in performance and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Durable and long-lasting material for reliable performance.

Propagation Delay: 17 ns

Low propagation delay ensures fast response times in logic operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage for compatibility with most systems.

No. of Terminals: 14

Provides enough terminals for connecting multiple components in a circuit.

Output Characteristics: 3-STATE

3-state output allows for high impedance state in addition to logic high and low, increasing versatility.

Technology: TTL

TTL technology is known for its reliability and compatibility with various applications.

Technical Specifications

Logic Gates JM38510/37006BCA attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

4.4 mA

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

17 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/37006BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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